Shennan Circuits funding history / development milestones

IPO上市，主板

2017.12.13，深交所

Note: collected from public online reports, for reference only.

Talent Demand Trend Analysis More

PCBA

电路板

基板

封装基板

线路板

国产化

航空航天电子

航天电子

封装

电子电路

机器学习

智能化

印刷电路板/PCB

通信技术

光通信模块

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Shenzhen最新融资  全国“PCBA”最新融资  全国“电路板”最新融资  全国“基板”最新融资  全国“封装基板”最新融资  全国“线路板”最新融资  附近的公司 