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About the Company

[Summary] 全球SiC晶片的主要生产商之一

北京天科合达半导体股份有限公司于2006年9月由新疆天富集团、中国科学院物理研究所共同设立,目前注册资本为50600万元,是一家专业从事第三代半导体碳化硅(SiC)晶片研发、生产和销售的高新技术企业。
公司自成立以来,专注于碳化硅晶体生长和晶片加工的技术研发,建立了国内*条碳化硅晶片中试生产线,是国内*早实现碳化硅晶片 产业化的企业,在国内率先成功研制出 6 英寸碳化硅晶片,相继实现 2 英寸至 6 英寸碳化硅晶片产品的规模化供应,掌握了覆盖碳化硅晶片生产的“设备研制—原料合成—晶体生长 —晶体切割—晶片加工—清洗检测”全流程关键技术和工艺。

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天科合达 How Fast Is Hiring Growing? (3 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 57%
  • 2024: Down 11%
  • 2023: Up 142%
  • 2022: Up 550%
天科合达 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 北京天科合达半导体股份有限公司 growing? 天科合达2025: 24 openings (down 57%), 2024: 56 openings (down 11%), 2023: 63 openings (up 142%), 2022: 26 openings (up 550%), 2021: 4 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

天科合达 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Down 60%
  • 2024: Up 25%
  • 2023: Up 700%
天科合达 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 北京天科合达半导体股份有限公司 growing? 天科合达Master's recruitment over the years: 2025: 4 openings (down 60%), 2024: 10 openings (up 25%), 2023: 8 openings (up 700%), 2022: 1 openings.

天科合达 — What Are the Salaries Like? (22 records)

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天科合达 Salary Overview
salary range: 6K - 50K, 72.8% of roles pay ¥6-15K
Note: salary statistics are based on 22 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 北京天科合达半导体股份有限公司?天科合达72.8%的岗位拿6-15K,本科 salary: ¥。Compared with the industry-39%,工厂生产类平均工资¥13.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 天科合达

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Are salaries high at 北京天科合达半导体股份有限公司? We provide: 质量,qe,技工,技师,erp,mes,体系工程师,体系高级工程师,助理工程,工艺工程,施工,普工,机械工,机械设计,测试工程,物料工程师,物料管理,管理工程师,精益主管,自动化. Click to view detailed salary analysis by job.

天科合达 honors, qualifications & industry associations

天科合达 Related Industry Tags

Job Category

  • 工厂生产类
    36.4% of total 36.4%
  • 质量管理类
    36.4% of total 36.4%
  • 技工类
    22.7% of total 22.7%
  • 其他(研发和技术类)
    18.2% of total 18.2%

Education

  • 本科
    68.2% of total 68.2%
  • 大专
    18.2% of total 18.2%
  • 高中
    9.1% of total 9.1%
  • 硕士
    4.5% of total 4.5%

Experience

  • 3-5年
    54.5% of total 54.5%
  • 1-3年
    31.8% of total 31.8%
  • 5-10年
    9.1% of total 9.1%
  • 不限
    4.5% of total 4.5%
View Detailed Analysis

What does 北京天科合达半导体股份有限公司 require? Who is 天科合达 hiring? 天科合达 recruitment: 工厂生产类占比最多占36.4%,其次是质量管理类占36.4%. What education can get in at 天科合达? 本科占比最多占68.2%,其次是大专占18.2%. High education required at 天科合达? 硕士占4.5%. Work experience required at 天科合达? 3-5年占比最多占54.5%,其次是1-3年占31.8%. Where are the job locations at 天科合达? 北京占比最多占50%,其次是深圳占36.4%. Based on job postings from the past year, for reference only.

Business Registration

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Operating Status: 开业
Registered Capital: 50,600万(元)
Legal Representative: 杨建
Date Established:
Credit Code: 91110108792101765W
Registered Address: 北京市大兴区丰远街1号院1号楼

Partners & Suppliers

作为碳化硅衬底供应商,与深圳昕感科技有限责任公司签署战略合作协议,供应SiC衬底材料。 Source
合作客户 碳化硅衬底
晶升电子向天科合达供应碳化硅晶体生长设备 Source
供应商 碳化硅衬底制造
宽能半导体与天科合达签订SiC衬底供应协议 Source
合作客户 衬底材料
汉希科特采购天科合达的碳化硅衬底用于SiC器件生产 Source
合作客户 碳化硅衬底
天科合达向基本半导体供应碳化硅衬底 Source
合作客户 供应链 - SiC衬底

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