惠州联合铜箔电子材料有限公司 Reviews, Salaries and Jobs

Note: How fast is hiring at 惠州联合铜箔电子材料有限公司 growing? 2026: 28 openings (up 40%), 2025: 20 openings (down 53%), 2024: 43 openings (down 57%), 2023: 101 openings (up 226%), 2022: 31 openings (up 3%), 2021: 30 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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Growth Rate

Master's Hiring by Year: 2024 — 2 fewer jobs than 2023

2023 3 jobs 2024 1 jobs

* Hiring was generally low during 2020-2022 due to the pandemic

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Master's Salary 򀀩

How fast is master's hiring at 惠州联合铜箔电子材料有限公司 growing? Master's recruitment over the years: 2024: 1 openings (down 57%), 2023: 3 openings (up 226%).

— What Are the Salaries Like? (38 records)

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Salary Overview

￥6-15K

65.8% of roles pay

salary range: 3K - 30K, 65.8% of roles pay ￥6-15K

2.6% 3-4.5K 15.8% 4.5-6K ***  ? 6-8K 10.5% 8-10K ***  ? 10-15K 7.9% 15-20K 7.9% 20-30K

Note: salary statistics are based on 38 salary records from the past year and depend on the job sample. For reference only.

Salary Ranking

By Category

技工类￥7.3K  机械/仪器仪表类  人力资源类  质量管理类  其他（研发和技术类） 

How is the salary at 惠州联合铜箔电子材料有限公司?65.8% of positions earn 6-15K, Undergraduate salary: ¥。Huizhou salary ranking: #473，技工类 average salary ¥7.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 惠州联合铜箔电子材料有限公司? We provide: 人事，品质经理，操作工，普工，会计，机修，电气，设备工，mc专员，厨师，叉车，司机，品质工程，培训，技术工程师，操作员，机加工，机械工，氩弧焊，焊工. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

技工类
42.1% of total 42.1%
机械/仪器仪表类
18.4% of total 18.4%
人力资源类
15.8% of total 15.8%
质量管理类
13.2% of total 13.2%

Job Location

惠州
100% of total 100%

Education

高中
31.6% of total 31.6%
大专
28.9% of total 28.9%
本科
28.9% of total 28.9%
不限
10.5% of total 10.5%

Experience

3-5年
50% of total 50%
1-3年
23.7% of total 23.7%
不限
23.7% of total 23.7%
5-10年
2.6% of total 2.6%

View Detailed Analysis

What does 惠州联合铜箔电子材料有限公司 require? Who is 惠州联合铜箔电子材料有限公司 hiring? recruitment: 技工类占比最多占42.1%，其次是机械/仪器仪表类占18.4%. What education can get in at ? 高中占比最多占31.6%，其次是大专占28.9%. Work experience required at ? 3-5年占比最多占50%，其次是1-3年占23.7%. Where are the job locations at ? 惠州占比最多占100%. Based on job postings from the past year, for reference only.