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About the Company

[Summary] 无晶圆半导体系统设计厂商

晶晨半导体是一家全球性的芯片设计公司,1995年始创于硅谷,2003年成立于上海,2019年科创板首批上市。为智能机顶盒、智能电视、智能家居等多个产品领域,提供多媒体SoC芯片和系统级解决方案,技术先进性和市场覆盖率位居行业前列。同时积极布局智能影像、无线连接、汽车电子等新市场,助力开启AIoT新时代。晶晨半导体拥有丰富的SoC全流程设计经验,坚持超高清多媒体编解码和显示处理、人工智能、内容安全保护、系统IP等核心软硬件技术开发,整合前沿的CPU/GPU技术和先进制程工艺,实现成本、性能和功耗的优化,提供基于多种开放平台的完整系统解决方案,帮助全球的主要运营商、OEM、ODM等客户快速部署市场。晶晨半导体创立于美国硅谷,目前在圣克拉拉、上海、深圳、北京、青岛、台北、香港、首尔、孟买、伦敦、慕尼黑、印第安纳波利斯、米兰等地设有主体或代表处。

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晶晨股份 Financing History (1 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal: 上交所

晶晨股份 How Fast Is Hiring Growing? (74 open positions)

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Note: How fast is hiring at 晶晨半导体(上海)股份有限公司 growing? 晶晨股份2025年47个(增长7%),2024年44个(下降71%),2023年151个(下降59%),2022年368个(下降17%),2021年445个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

晶晨股份 Master's Degree Job Demand Analysis

(More)
?
Growth Rate
2026 vs 2025
  • 2025: Down 67%
  • 2024: Down 94%
  • 2023: Up 4%
  • 2022: Up 5%
晶晨股份 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 晶晨半导体(上海)股份有限公司 growing? 晶晨股份历年硕士招聘职位量:2025年1个(下降67%),2024年3个(下降94%),2023年47个(增长4%),2022年45个(增长5%),2021年43个.

晶晨股份 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 晶晨半导体(上海)股份有限公司? Based on an analysis of 晶晨股份's job postings over the past year, “计算机/网络/技术类”需求占93.8%,“电子/电器/通信技术类”占56.3%,“其他(研发和技术类)”占25%,“医疗卫生/美容保健类”占18.8%,“电气/能源/动力类”占6.3%. For reference only.

晶晨股份 — What Are the Salaries Like? (16 records)

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晶晨股份 Salary Overview
salary range: 20K - 50K, 100% of roles pay ¥20-50K
Note: salary statistics are based on 16 salary records from the past year and depend on the job sample. For reference only.
晶晨半导体(上海)股份有限公司工资待遇怎么样?晶晨股份100%的岗位拿20-50K,应届生工资¥。上海地区工资排名前15%,与同行业比+57%,计算机/网络/技术类平均工资¥37.0K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

晶晨股份 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

晶晨股份 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    58.4% of total 58.4%
  • 电子/电器/通信技术类
    43.1% of total 43.1%
  • 质量管理类
    20.6% of total 20.6%
  • 其他(研发和技术类)
    13.4% of total 13.4%

Education

  • 不限
    81.3% of total 81.3%
  • 本科
    16.3% of total 16.3%
  • 硕士
    2.4% of total 2.4%

Experience

  • 不限
    81.8% of total 81.8%
  • 1-3年
    6.7% of total 6.7%
  • 5-10年
    5.3% of total 5.3%
  • 3-5年
    4.3% of total 4.3%
View Detailed Analysis

What does 晶晨半导体(上海)股份有限公司 require? Who is 晶晨股份 hiring? 晶晨股份招聘类别计算机/网络/技术类占比最多占58.4%,其次是电子/电器/通信技术类占43.1%。晶晨股份什么学历能进?不限占比最多占81.3%,其次是本科占16.3%。晶晨股份学历要求高吗?硕士占2.4%。工作经验晶晨股份有什么要求?不限占比最多占81.8%,其次是1-3年占6.7%。晶晨股份工作地区在哪?上海占比最多占43.5%,其次是深圳占15.8%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 41,832.6368万(元)
Legal Representative: JOHN ZHONG
Date Established:
Credit Code: 913100007518999777
Registered Address: 中国(上海)自由贸易试验区春晓路350号南楼406室

Partners & Suppliers

提供测试服务 Source
供应商 芯片设计(数字/模拟/射频)
采购晶晨系列智能机顶盒主控芯片 Source
合作客户 芯片/主控
智微智能基于晶晨芯片开发智能显示和物联网终端,采购其SoC Source
合作客户 CPU/SoC芯片
嘉喆科技为晶晨半导体提供芯片封装测试服务,是其主要封测供应商之一。 Source
供应商 芯片封测服务
晶晨股份将部分芯片封装测试订单交由浙江创豪完成。 Source
供应商 芯片设计

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