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Company Overview

Development Stage

About the Company

无锡升滕半导体技术有限公司,公司规模为150-500人,公司类型为民营公司,所属行业为机械/设备/重工。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (39 open positions)

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Note: How fast is hiring at 无锡升滕半导体技术有限公司 growing? 2025年31个(增长35%),2024年23个(下降12%),2023年26个(下降47%),2022年49个(增长23%),2021年40个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (57 records)

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salary range: 4.5K - 50K, 70.2% of roles pay ¥8-15K
Note: salary statistics are based on 57 salary records from the past year and depend on the job sample. For reference only.
无锡升滕半导体技术有限公司工资待遇怎么样?70.2%的岗位拿8-15K,本科工资¥。与同行业比-10%,工厂生产类平均工资¥10.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 无锡升滕半导体技术有限公司? We provide: 数控,会计,机加工,财务,销售,工艺工程,生产计划,采购,cnc,质量,bp,仓库,体系工程师,外协,总账,计划专员,车床,阳极氧化技术员,ehs,nc技术员. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Job Category

  • 工厂生产类
    36.8% of total 36.8%
  • 技工类
    35.1% of total 35.1%
  • 质量管理类
    19.3% of total 19.3%
  • 财务/审计/统计类
    17.5% of total 17.5%

Education

  • 本科
    42.1% of total 42.1%
  • 大专
    36.8% of total 36.8%
  • 不限
    12.3% of total 12.3%
  • 高中
    8.8% of total 8.8%

Experience

  • 不限
    38.6% of total 38.6%
  • 3-5年
    28.1% of total 28.1%
  • 1-3年
    19.3% of total 19.3%
  • 5-10年
    14% of total 14%
View Detailed Analysis

What does 无锡升滕半导体技术有限公司 require? Who is 无锡升滕半导体技术有限公司 hiring? 招聘类别工厂生产类占比最多占36.8%,其次是技工类占35.1%。什么学历能进?本科占比最多占42.1%,其次是大专占36.8%。工作经验有什么要求?不限占比最多占38.6%,其次是3-5年占28.1%。工作地区在哪?无锡占比最多占98.2%,其次是合肥占1.8%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 2,000万(元)
Legal Representative: 孙德付
Date Established:
Credit Code: 913202145629822105
Registered Address: 无锡市新吴区城南路228号无锡新区旺庄工业发展有限公司三楼302(经营场所:无锡国家高新技术产业开发区93号地块A2号厂房)

Partners & Suppliers

向其供应半导体设备零部件(功率器件产线) Source
合作客户 功率半导体
向其供应半导体设备零部件(功率器件产线) Source
合作客户 功率半导体
向其供应清洗设备零部件 Source
合作客户 半导体设备
向其供应光刻机相关零部件 Source
合作客户 半导体设备
向其供应半导体设备零部件 Source
合作客户 半导体设备

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