Company Overview

Development Stage

About the Company

[Summary] 为中国芯崛起而奋斗

一、公司简介
浙江地芯引力科技有限公司成立于 2019 年 6 月,注册资本 1142.97 万元, 由国家万人计划人才王敏创立。公司专注于消费电子、信息安全等半导体 集成电路细分领域,是一家以科技创新为动力,精通产品开发和市场运营的数 模混合集成电路雏鹰企业。公司座落于杭州市萧山区数字经济新硅谷——杭州 湾信息港,并于深圳、成都分别设立销售服务支持中心及研发分中心。
公司主营产品涵盖电源管理芯片、信息安全芯片、信号链芯片等领域。公司部分产品的市场份额已位居国内前列,与多家行业知名大客户建立稳定合作。现有研发场地约 3000 余平方米。公司核心创始团队具备 15 年以上的芯片设计和产品开发经验。
企业荣誉资质方面, 先后被评为国家重点集成电路设计企业、国家高新技术企业、国家科技型中小 企业、“专精特新”中小企业、准独角兽企业、杭州市雏鹰计划企业、杭州市 专利试点企业、“双软”认证企业、萧山区金凤凰企业等荣誉称号,取得团体标准起草人(USB 充电线通用技术要求)等行业标准化资质荣誉,在消费电子 芯片和信息安全芯片细分领域具备全球隐形独角兽的实力。
产学研校企合作方面,公司已与多家院校成立联合实验室,已开展多项横向项目合作,将本着 “先进科研赋能产业化”的宗旨,进一步围绕数字电源、第三代半导体等方向探索产学研技术成果转化与合作、联合培养人才与定向输送等模式,不断加快 专业人才梯队建设,提升研发创新储备能力。
知识产权方面,地芯引力总计申请200多项知识产权。包括发明专利 164项(授权 81项),实用新型37项(授权 32项),商标 60项(已注册43 项),软件著作权 14 项,集成电路布图设计专有权 28项(授权 28项), PCT 申请 3件。
二、公司研发技术
公司核心创始团队具备15年以上的芯片设计和产品开发经验。以成熟稳重的80后为骨干、朝气蓬勃的90后为主体。公司为每一位员工量身定制适合的晋升通道及职级体系、广阔的发展空间、多样的人才激励政策等。

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地芯引力 Financing History (5 rounds)

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股权融资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 浙科投资

地芯引力 How Fast Is Hiring Growing? (78 open positions)

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Note: How fast is hiring at 浙江地芯引力科技有限公司 growing? 地芯引力2026: 123 openings (down 31%), 2025: 179 openings (up 48%), 2024: 121 openings (up 9%), 2023: 111 openings (down 15%), 2022: 131 openings (up 96%), 2021: 67 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

地芯引力 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 32%
  • 2024: Up 340%
  • 2023: Up 67%
  • 2022: Up 200%
地芯引力 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 浙江地芯引力科技有限公司 growing? 地芯引力Master's recruitment over the years: 2025: 29 openings (up 32%), 2024: 22 openings (up 340%), 2023: 5 openings (up 67%), 2022: 3 openings (up 200%), 2021: 1 openings.

地芯引力 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 浙江地芯引力科技有限公司? Based on an analysis of 地芯引力's job postings over the past year, "电子/电器/通信技术类" demand: 86.4%, "计算机/网络/技术类": 63.6%, "其他(研发和技术类)": 22.8%, "电气/能源/动力类": 7.4%, "生物/制药/化工/环保类": 6.2%, "机械/仪器仪表类": 3.1%. For reference only.

地芯引力 — What Are the Salaries Like? (162 records)

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salary range: 3K - 50K, 80.8% of roles pay ¥20-50K
Note: salary statistics are based on 162 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 浙江地芯引力科技有限公司?地芯引力80.8% of positions earn 20-50K, Fresh graduate salary: ¥25.0K。Hangzhou salary ranking top 10,电子/电器/通信技术类 average salary ¥35.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 地芯引力

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Are salaries high at 浙江地芯引力科技有限公司? We provide: bm,嵌入式,软件工程,硬件,设计工程师,算法,ae,fa,ic设计,技术专家,软件设计,测试工程,验证工程师,版图工程师,开发工程师,设计高级工程师,软件开发,pd,产品工程,前端. Click to view detailed salary analysis by job.

地芯引力 Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    83.5% of total 83.5%
  • 计算机/网络/技术类
    63.1% of total 63.1%
  • 其他(研发和技术类)
    23.3% of total 23.3%
  • 质量管理类
    11.4% of total 11.4%

Education

  • 本科
    80.1% of total 80.1%
  • 硕士
    15.3% of total 15.3%
  • 大专
    3.4% of total 3.4%
  • 不限
    1.1% of total 1.1%

Experience

  • 5-10年
    42.6% of total 42.6%
  • 不限
    37.5% of total 37.5%
  • 3-5年
    14.8% of total 14.8%
  • 1-3年
    4.5% of total 4.5%
View Detailed Analysis

What does 浙江地芯引力科技有限公司 require? Who is 地芯引力 hiring? 地芯引力 recruitment: 电子/电器/通信技术类占比最多占83.5%,其次是计算机/网络/技术类占63.1%. What education can get in at 地芯引力? 本科占比最多占80.1%,其次是硕士占15.3%. High education required at 地芯引力? 硕士占15.3%. Work experience required at 地芯引力? 5-10年占比最多占42.6%,其次是不限占37.5%. Where are the job locations at 地芯引力? 杭州占比最多占55.7%,其次是深圳占23.3%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,371.7883万(元)
Legal Representative: 王敏
Date Established:
Credit Code: 91330109MA2GMYW79H
Registered Address: 浙江省杭州市萧山区建设三路733号信息港五期H座111

Partners & Suppliers

为地芯引力提供芯片封装与测试服务。 Source
供应商 芯片封测
为地芯引力提供晶圆代工服务,采用0.18μm BCD工艺生产电源管理芯片。 Source
供应商 芯片代工

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