Company Overview

Development Stage

About the Company

成都仕芯半导体有限公司(Chengdu SiCore SemiconductCo.,Ltd.)成立于2017年8月,是一家专业从事射频/微波集成电路芯片,组件和系统解决方案的设计、开发、生产销售的高科技公司。公司位于成都高新西区汇都总部园内,具备技术能力过硬的专业团队,联合了电子科技大学、西北工业大学等多家知名大学的专家教授、博士生导师、高级工程师和科研骨干,为产品的设计、研发提供了有力的技术保障。微波高频集成电路芯片是半导体产业的一个重要分支,是通信,仪器仪表等多领域的核心支撑产品。我们依托于公司创业团队雄厚的技术储备,致力于满足国内外市场日益增长的对高性能,高集成度和低成本的高频率集成芯片的需求,为国内外客户提供自主研发的射频/微波集成电路芯片和组件产品。我们将不断优化设计技术和生产工艺,丰富产品种类,积累客户资源,立足国内、面向海外,力争在*短时间内发展成为射频/微波器件及系统领域的国际一流企业。公司网页:*

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Financing History (2 rounds)

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C轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 1亿人民币
  • Investor: 达晨财智,齐芯资本

How Fast Is Hiring Growing? (9 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 178%
  • 2024: Down 70%
  • 2023: Down 9%
  • 2022: Down 20%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Campus Recruitment & Advanced Degree Talent Demand
Master's 1
Note: How fast is hiring at 成都仕芯半导体有限公司 growing? 2026: 26 openings (up 4%), 2025: 25 openings (up 178%), 2024: 9 openings (down 70%), 2023: 30 openings (down 9%), 2022: 33 openings (down 20%), 2021: 41 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

(More)
?
Growth Rate
2026 vs 2025
  • 2025: Down 40%
  • 2024: Up 25%
  • 2023: Up 300%
Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 成都仕芯半导体有限公司 growing? Master's recruitment over the years: 2025: 3 openings (down 40%), 2024: 5 openings (up 25%), 2023: 4 openings (up 300%), 2022: 1 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 成都仕芯半导体有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 54.5%, "其他(研发和技术类)": 15.2%, "计算机/网络/技术类": 6.1%. For reference only.

— What Are the Salaries Like? (33 records)

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salary range: 4.5K - 50K, 72.8% of roles pay ¥15-50K
Note: salary statistics are based on 33 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 成都仕芯半导体有限公司?72.8% of positions earn 15-50K, Undergraduate salary: ¥。Chengdu salary ranking top 20,电子/电器/通信技术类 average salary ¥32.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 成都仕芯半导体有限公司? We provide: 设计师,ic设计,芯片设计,测试工程,组装,pa,python,应用工程师,应用开发,开发工程师,模拟ic,质量,ae,fa,te,可靠性工程师,工艺工程,工装,操作员,生产测试. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    55.9% of total 55.9%
  • 质量管理类
    23.5% of total 23.5%
  • 其他(研发和技术类)
    14.7% of total 14.7%
  • 技工类
    8.8% of total 8.8%

Education

  • 本科
    52.9% of total 52.9%
  • 硕士
    23.5% of total 23.5%
  • 不限
    11.8% of total 11.8%
  • 大专
    8.8% of total 8.8%

Experience

  • 不限
    38.2% of total 38.2%
  • 3-5年
    32.4% of total 32.4%
  • 1-3年
    20.6% of total 20.6%
  • 5-10年
    8.8% of total 8.8%
View Detailed Analysis

What does 成都仕芯半导体有限公司 require? Who is 成都仕芯半导体有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占55.9%,其次是质量管理类占23.5%. What education can get in at ? 本科占比最多占52.9%,其次是硕士占23.5%. High education required at ? 硕士占23.5%. Work experience required at ? 不限占比最多占38.2%,其次是3-5年占32.4%. Where are the job locations at ? 成都占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 5,025.1256万(元)
Legal Representative: 陈有强
Date Established:
Credit Code: 91510100MA6DFT2F6M
Registered Address: 成都高新区百川路9号1号楼4层

Partners & Suppliers

提供芯片封装测试服务 Source
供应商 封装测试
提供晶圆代工服务生产射频芯片 Source
供应商 晶圆代工
为其雷达系统提供微波器件 Source
合作客户 军用电子
为其军用通信系统提供射频芯片 Source
合作客户 军用电子
向其供应射频芯片用于通信设备 Source
合作客户 通信设备

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