Company Overview

Development Stage

About the Company

东和半导体设备(南通)有限公司成立于2018年10月,由日本TOWA株式会社独资设立,主要生产并销售半导体生产设备,半导体生产用精密模具,并提供上述产品的设计、技术服务及售后服务(一般项目:金属表面处理及热处理加工)。总部TOWA株式会社(英文名:TOWA CORPORATION)在东京证交所上市。在其主营业务半导体封装设备和半导体封装模具领域,技术能力在半导体设备*全球,设备市场占有率超过50%,在中国的市场占有率超过70%,期待优秀的您加入我们!

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东和半导体设备 How Fast Is Hiring Growing? (35 open positions)

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Note: How fast is hiring at 东和半导体设备(南通)有限公司 growing? 东和半导体设备2026: 69 openings (down 28%), 2025: 96 openings (up 146%), 2024: 39 openings (up 70%), 2023: 23 openings (down 12%), 2022: 26 openings (down 53%), 2021: 55 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

东和半导体设备 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 东和半导体设备(南通)有限公司? Based on an analysis of 东和半导体设备's job postings over the past year, "机械/仪器仪表类" demand: 24.8%, "其他(研发和技术类)": 20.9%, "生物/制药/化工/环保类": 16.3%, "电气/能源/动力类": 13.2%, "电子/电器/通信技术类": 2.3%. For reference only.

东和半导体设备 — What Are the Salaries Like? (129 records)

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salary range: 4.5K - 50K, 96.2% of roles pay ¥6-50K
Note: salary statistics are based on 129 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 东和半导体设备(南通)有限公司?东和半导体设备96.2% of positions earn 6-50K, Fresh graduate salary: ¥10.8K。Nantong salary ranking top 30,技工类 average salary ¥17.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 东和半导体设备

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Are salaries high at 东和半导体设备(南通)有限公司? We provide: 设计工程师,操作员,电气,电镀,磨床,cnc,化学,学工,工艺工程,装配,机械设计,助理工程,操作工,机械助理,nc技术员,切割,技工,调试,dm,技术担当. Click to view detailed salary analysis by job.

东和半导体设备 Related Industry Tags

Job Category

  • 技工类
    52.7% of total 52.7%
  • 机械/仪器仪表类
    24.8% of total 24.8%
  • 其他(研发和技术类)
    20.9% of total 20.9%
  • 工厂生产类
    20.2% of total 20.2%

Education

  • 本科
    34.1% of total 34.1%
  • 不限
    27.9% of total 27.9%
  • 高中
    19.4% of total 19.4%
  • 大专
    17.1% of total 17.1%

Experience

  • 不限
    77.5% of total 77.5%
  • 3-5年
    12.4% of total 12.4%
  • 1-3年
    8.5% of total 8.5%
  • 应届生
    1.6% of total 1.6%
View Detailed Analysis

What does 东和半导体设备(南通)有限公司 require? Who is 东和半导体设备 hiring? 东和半导体设备 recruitment: 技工类占比最多占52.7%,其次是机械/仪器仪表类占24.8%. What education can get in at 东和半导体设备? 本科占比最多占34.1%,其次是不限占27.9%. Work experience required at 东和半导体设备? 不限占比最多占77.5%,其次是3-5年占12.4%. Where are the job locations at 东和半导体设备? 南通占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

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Operating Status: 开业
Registered Capital: 3,000万(元)
Legal Representative: TONG HUA
Date Established:
Credit Code: 91320691MA1X9HHC0A
Registered Address: 南通市开发区东和路8号

Partners & Suppliers

东和半导体设备(南通)有限公司为安靠中国工厂提供半导体封装设备,用于球栅阵列封装等工艺。 Source
合作客户 半导体封装测试设备
日月光半导体采用东和半导体设备的封装设备,用于其全球封测产线。 Source
合作客户 半导体封装测试设备
华天科技采购东和半导体设备的封装设备,用于QFN、BGA等封装产品生产。 Source
合作客户 半导体封装测试设备
东和半导体设备(南通)有限公司向通富微电供应封装设备,支持其FC-BGA等封装工艺。 Source
合作客户 半导体封装测试设备
东和半导体设备(南通)有限公司为长电科技提供半导体封装设备,包括注塑机等,用于先进封装生产线。 Source
合作客户 半导体封装测试设备

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