About the Company

富民微科技是半导体封装测试专业公司,主要从事传感器的封装和测试,领先技术,专注领先世界的创新技术。

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Operating Status: 开业
Registered Capital: 200万(元)
Legal Representative: 王立
Date Established:
Credit Code: 91440300MA5F73DD5R
Registered Address: 深圳市宝安区松岗街道东方社区田洋二路1号C501

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