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集成电路领域产品和服务提供商

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About the Company

[Summary] 集成电路领域产品和服务提供商

ESWIN奕斯伟是一家集成电路领域产品和服务提供商,核心事业涵盖芯片与方案、硅材料、先进封测三大领域。芯片与方案事业围绕移动终端、智慧家居、智慧交通、工业物联网等应用场景,为客户提供显示、智慧连接、智能计算和多媒体SoC等四类芯片及解决方案。硅材料事业主要包括12英寸全球先进制程硅单晶抛光片和外延片。先进封测事业主要包括芯片后端封测、COF卷带、板级集成封测三类业务。

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Business Registration

Provided by

Operating Status: 开业
Registered Capital: 3,608.26万(元)
Legal Representative: 王东升
Date Established:
Credit Code: 91110302MA0048YP1U
Registered Address: 北京市北京经济技术开发区科创十街18号院2号楼3层

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