Loongson funding history / development milestones

IPO上市，

2022.06.24，上交所

Note: collected from public online reports, for reference only.

Talent Demand Trend Analysis More

微电子

集成电路设计

集成电路/IC

电子设备

通用处理器

嵌入式

硬件

芯片设计

CPU

物联网/IoT

工业SaaS

信息安全

工业控制

芯片

公共安全

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