Canxin Semiconductor Stock funding history / development milestones

IPO上市，

2024.04.11，上交所

Note: collected from public online reports, for reference only.

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半导体

芯片设计

芯片

集成电路/IC

asic芯片

微电子

晶圆代工

SOC

ASIC

集成电路制造

物联网/IoT

Turn-key

系统级芯片

soc芯片

芯片架构

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无锡中微亿芯有限公司

电子厂/电子芯片处理器芯片 RISC-V

英飞凌科技（中国）有限公司

“高能效、移动性和安全性提供先进的半导体产品与系统解决方案”

Schneider Electric (China) Co., Ltd.

“Power distribution, industrial control and automation”

Advanced Micro Devices (China) Co., Ltd.

“Accelerating next-generation computing experiences”

Shenzhen HeYuan Technology Co., Ltd.

“One-stop professional electronic atomization technology solution provi”

Yangtze Memory Technologies Co., Ltd.

“Writing memories with chips, letting the world's beauty last forever”

Telink Semiconductor (Shanghai) Co., Ltd.

“Bring Telink chips to global users, helping to realize a world of inte”

ASE Semiconductor (Suzhou) Co., Ltd.

“Well-known semiconductor packaging and testing enterprise”

XMC (Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.)

“Professional 12-inch wafer foundry services, R&D and production of mem”

永芯科技（北京）有限公司

半导体硬件集成电路制造芯片设计

Unisoc (Shanghai) Technologies Co., Ltd.

“Platform-type chip design enterprise”

Yangzhou Yangjie Electronic Technology Co., Ltd.

“Vertically integrated IDM covering semiconductor discrete device chip ”

中山市元盛电子科技有限公司

软性电路板芯片电路板薄膜开关

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