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About the Company

[Summary] 让泰凌的芯片进入全球用户,帮助实现万物互连的世界

泰凌微电子(上海)股份有限公司(股票代码:688591.SH)成立于2010年6月,是一家专业的集成电路设计企业, 主要从事无线物联网系统级芯片的研发、设计及销售,专注于无线物联网芯片领域的前沿技术开发与突破。 通过多年的持续攻关和研发积累,已成为全球该细分领域产品种类*为齐全的代表性企业之一。
公司自成立以来一直以“让泰凌的芯片进入全球用户,帮助实现万物互连的世界” 为使命。在这一使命下,公司成功研发出一系列具有自主知识产权、国际一流性能水平的无线物联网系统级芯片,得到客户和市场的认可。主要产品的核心参数达到或超过国际超越企业技术水平,广泛支持包括智能零售、消费电子、智能照明、智能家居、智慧医疗、仓储物流、音频娱乐在内的各类消费级和商业级物联网应用。产品广泛应用于汉朔、小米罗技(Logitech)、欧之(Home Control)、涂鸦智能、朗德万斯(Ledvance)、瑞萨(Renesas)、科大讯飞创维、夏普(Sharp)、松下(Panasonic)、英伟达(Nvidia)、哈曼(Harman)等多家主流终端知名品牌。

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泰凌微 Financing History (3 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal: 上交所

泰凌微 How Fast Is Hiring Growing? (50 open positions)

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Note: How fast is hiring at 泰凌微电子(上海)股份有限公司 growing? 泰凌微2025年100个(增长85%),2024年54个(下降4%),2023年56个(下降36%),2022年87个(下降24%),2021年114个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

泰凌微 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Up 360%
  • 2024: Down 52%
  • 2023: Down 9%
  • 2022: Up 44%
泰凌微 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 泰凌微电子(上海)股份有限公司 growing? 泰凌微历年硕士招聘职位量:2025年46个(增长360%),2024年10个(下降52%),2023年21个(下降9%),2022年23个(增长44%),2021年16个. 泰凌微在上海硕士人才需求中排名第200, 泰凌微硕士工资大部分在30-50K以上.

泰凌微 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 泰凌微电子(上海)股份有限公司? Based on an analysis of 泰凌微's job postings over the past year, “电子/电器/通信技术类”需求占61.7%,“计算机/网络/技术类”占59.1%,“其他(研发和技术类)”占26.1%,“生物/制药/化工/环保类”占7%,“美术/设计/创意类”占1.7%,“机械/仪器仪表类”占0.9%. For reference only.

泰凌微 — What Are the Salaries Like? (115 records)

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salary range: 3K - 50K, 73% of roles pay ¥20-50K
Note: salary statistics are based on 115 salary records from the past year and depend on the job sample. For reference only.
泰凌微电子(上海)股份有限公司工资待遇怎么样?泰凌微73%的岗位拿20-50K,应届生工资¥20.6K。上海地区工资排名前35%,与同行业比+43%,电子/电器/通信技术类平均工资¥35.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 泰凌微

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Are salaries high at 泰凌微电子(上海)股份有限公司? We provide: 嵌入式,软件工程,设计工程师,软件开发,前端,实习生,技术支持,算法,芯片工程师,验证工程师,oc,模拟设计,硬件,销售,ba,ic设计,开发工程师,测试工程,bd,go. Click to view detailed salary analysis by job.

泰凌微 honors, qualifications & industry associations

泰凌微 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    60.1% of total 60.1%
  • 计算机/网络/技术类
    58.9% of total 58.9%
  • 其他(研发和技术类)
    24.4% of total 24.4%
  • 在校学生类
    8.9% of total 8.9%

Education

  • 本科
    43.5% of total 43.5%
  • 硕士
    35.1% of total 35.1%
  • 不限
    18.5% of total 18.5%
  • 大专
    2.4% of total 2.4%

Experience

  • 3-5年
    26.8% of total 26.8%
  • 不限
    26.2% of total 26.2%
  • 5-10年
    17.9% of total 17.9%
  • 1-3年
    14.9% of total 14.9%
View Detailed Analysis

What does 泰凌微电子(上海)股份有限公司 require? Who is 泰凌微 hiring? 泰凌微招聘类别电子/电器/通信技术类占比最多占60.1%,其次是计算机/网络/技术类占58.9%。泰凌微什么学历能进?本科占比最多占43.5%,其次是硕士占35.1%。泰凌微学历要求高吗?硕士占35.1%。工作经验泰凌微有什么要求?3-5年占比最多占26.8%,其次是不限占26.2%。泰凌微工作地区在哪?上海占比最多占73.8%,其次是深圳占11.3%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 24,000万(元)
Legal Representative: 盛文军
Date Established:
Credit Code: 91310000557430243L
Registered Address: 中国(上海)自由贸易试验区盛夏路61弄1号电梯楼层10层、11层(实际楼层9层、10层)

Partners & Suppliers

日月新苏州为泰凌微提供低功耗蓝牙芯片的封装测试。 Source
供应商 蓝牙音频芯片
采购泰凌微电子的芯片,用于交互智能平板等产品 Source
合作客户 终端客户(智能家居/消费电子)
采购泰凌微电子的无线连接芯片,用于移动通信设备 Source
合作客户 终端客户(智能家居/消费电子)
采购泰凌微电子的蓝牙芯片,用于智能家居等产品 Source
合作客户 终端客户(智能家居/消费电子)
电子元器件分销商,泰凌微电子的经销商之一 Source
合作客户 渠道/分销商

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泰凌微 Competitors (Similar Companies)

“物联网技术的研发者和无线通信模组的供应商”
“光纤预制棒、光纤和光缆供应商”
“改善人们的沟通与生活”
“以存储科技赋能信息社会,改善人类生活”
“功率及数模混合芯片设计”
“影像系统解决方案的创新技术”
半导体 芯片设计 物联网 IoT
“信号链芯片及其解决方案提供商”
“微电子产业集团”
“一站式芯片定制服务”
“激发创造 丰富生活”
“以太网物理层芯片供应商”
“领先的Fabless芯片供应商”
硬件 芯片设计 芯片 集成电路
半导体 车载电子 芯片 汽车零部件

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