Company Overview

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About the Company

[Summary] 存储芯片和MCU芯片研发、设计及销售

公司是一家主营业务为存储芯片和MCU芯片研发、设计及销售的集成电路设计企业。公司现有主营产品包括NFlash存储芯片和基于Arm® Cortex®-M0+内核架构的通用32位MCU芯片。同时,公司还在致力于开发基于NOR闪存技术的存算一体终端推理AI芯片,并提供边缘计算的完整解决方案。
公司聚焦“存储+控制”完整解决方案,截至2021年6月末,公司研发人员占员工总人数比例为61.46%,核心技术人员XIANGDONG LU博士及研发团队具有丰富的集成电路研发设计、管理及销售经验。经过不断自主研发,公司已掌握高可靠性、高速、低功耗65/50nm NFlash和55nm MCU设计技术,基于上述技术不断升级迭代相关产品,并完成基于NFlash制程的存算一体AI芯片的研发、流片和系统演示。
目前,公司NFlash芯片和MCU芯片均获得客户的广泛认可,与杰理科技、乐鑫科技、泰凌微电子、芯海科技、兆讯恒达、翱捷科技、上海巨微及赛腾微等客户建立了长期稳定的合作关系,多款产品进入小米、360、OPPO、星网锐捷、新大陆、中兴、联想、谷歌、罗技、奇瑞汽车、江铃汽车及欧菲光等终端用户供应链体系。
公司通过自主研发,已获授权的专利共17项(其中发明专利15项,实用新型专利2项),并拥有26项集成电路布图和20项软件著作权。
未来,公司将通过对现有产品工艺进行持续升级和新产品研发,持续保持产品性能优势,不断完善产品结构,强化公司竞争优势,提升市场份额、品牌形象和影响力,成为一家国内国际一流的集成电路设计企业,为员工提供成就辉煌事业的平台、追求美好生活的保障。欢迎才华横溢的您带着梦想和微笑来恒烁撸起袖子、挥洒汗水,成就奇迹!

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恒烁股份 Financing History (1 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal: 上交所

恒烁股份 How Fast Is Hiring Growing? (24 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 10%
  • 2024: Down 40%
  • 2023: Down 24%
  • 2022: Up 117%
恒烁股份 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
恒烁股份 Campus Recruitment & Advanced Degree Talent Demand
Interns 1 Master's 3
Note: How fast is hiring at 恒烁半导体(合肥)股份有限公司 growing? 恒烁股份2026: 17 openings (down 54%), 2025: 37 openings (down 10%), 2024: 41 openings (down 40%), 2023: 68 openings (down 24%), 2022: 89 openings (up 117%), 2021: 41 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

恒烁股份 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Down 50%
  • 2024: Down 56%
  • 2023: Down 36%
  • 2022: Up 27%
恒烁股份 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 恒烁半导体(合肥)股份有限公司 growing? 恒烁股份Master's recruitment over the years: 2025: 2 openings (down 50%), 2024: 4 openings (down 56%), 2023: 9 openings (down 36%), 2022: 14 openings (up 27%), 2021: 11 openings.

恒烁股份 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 恒烁半导体(合肥)股份有限公司? Based on an analysis of 恒烁股份's job postings over the past year, "电子/电器/通信技术类" demand: 53.5%, "其他(研发和技术类)": 18.6%, "计算机/网络/技术类": 11.6%, "生物/制药/化工/环保类": 4.7%. For reference only.

恒烁股份 — What Are the Salaries Like? (43 records)

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恒烁股份 Salary Overview
salary range: 3K - 50K, 79.1% of roles pay ¥15-50K
Note: salary statistics are based on 43 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 恒烁半导体(合肥)股份有限公司?恒烁股份79.1% of positions earn 15-50K, Undergraduate salary: ¥。Hefei salary ranking top 30,电子/电器/通信技术类 average salary ¥25.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 恒烁股份

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Are salaries high at 恒烁半导体(合肥)股份有限公司? We provide: mcu,销售,ae,应用工程师,测试工程,fa,产品工程,产品经理,仓储,实验室工程师,整合工程师,法务,物流专,设计工程师,验证工程师,ee,ic设计,ie,pi,qe. Click to view detailed salary analysis by job.

恒烁股份 honors, qualifications & industry associations

恒烁股份 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    53.5% of total 53.5%
  • 销售类
    20.9% of total 20.9%
  • 其他(研发和技术类)
    18.6% of total 18.6%
  • 质量管理类
    16.3% of total 16.3%

Education

  • 本科
    81.4% of total 81.4%
  • 大专
    11.6% of total 11.6%
  • 硕士
    7% of total 7%

Experience

  • 1-3年
    32.6% of total 32.6%
  • 不限
    27.9% of total 27.9%
  • 3-5年
    23.3% of total 23.3%
  • 5-10年
    16.3% of total 16.3%
View Detailed Analysis

What does 恒烁半导体(合肥)股份有限公司 require? Who is 恒烁股份 hiring? 恒烁股份 recruitment: 电子/电器/通信技术类占比最多占53.5%,其次是销售类占20.9%. What education can get in at 恒烁股份? 本科占比最多占81.4%,其次是大专占11.6%. High education required at 恒烁股份? 硕士占7%. Work experience required at 恒烁股份? 1-3年占比最多占32.6%,其次是不限占27.9%. Where are the job locations at 恒烁股份? 上海占比最多占51.2%,其次是合肥占25.6%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 8,292.9413万(元)
Legal Representative: XIANG DONG LU
Date Established:
Credit Code: 91340100327991758Q
Registered Address: 合肥市庐阳区天水路与太和路交口西北庐阳中科大校友企业创新园11号楼

Partners & Suppliers

作为发起单位参与RISC-V芯片设计与应用推广 Source
合作客户 芯片设计/IP
NOR Flash封装 Source
供应商 芯片设计公司
厦门吉瑞普电子科技有限公司是恒烁股份的授权代理商,代理其MCU、存储芯片等产品。 Source
合作客户 芯片/半导体
提供芯片测试服务 Source
供应商 芯片设计
采购恒烁半导体的MCU产品用于相关电子产品 Source
合作客户 通信模块/终端

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恒烁股份 Competitors (Similar Companies)

集成电路封装测试 集成电路封装 芯片封装 半导体
智能硬件 电源 变压器 电子系统
微波 微波射频 射频微波器件 生产
传感器 集成电路设计 集成电路/IC 光纤
继电器 功率继电器 高压直流接触器 先进材料
“Semiconductor packaging, SMT patch, and lighting research and developm”
“Development of automotive intelligent systems”
半导体 可靠性试验 存储设备 烤盘
微电子 集成电路/IC 半导体 电路芯片
光电设备 光纤 雷达 光纤滑环
“存储芯片研发商”
“Research, development, and production of direct imaging equipment and ”
“Empowering smart city operations and the intelligent upgrade of reside”
“Integrated circuit manufacturer”
“Chip of the East, Independent Innovation”

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