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Company Overview

Development Stage

About the Company

惠州市芯瓷半导体有限公司,公司规模为150-500人,公司类型为民营公司,所属行业为电子技术/半导体/集成电路。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (1 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 79%
  • 2024: Up 56%
  • 2023: Flat 0%-
  • 2022: Up 80%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 惠州市芯瓷半导体有限公司 growing? 2025年25个(增长79%),2024年14个(增长56%),2023年9个(持平),2022年9个(增长80%),2021年5个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (18 records)

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salary range: 4.5K - 15K, 94.5% of roles pay ¥6-15K
Note: salary statistics are based on 18 salary records from the past year and depend on the job sample. For reference only.
惠州市芯瓷半导体有限公司工资待遇怎么样?94.5%的岗位拿6-15K,本科工资¥。惠州地区工资排名第423,与同行业比-21%,技工类平均工资¥10.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Job Category

  • 技工类
    38.9% of total 38.9%
  • 工厂生产类
    33.3% of total 33.3%
  • 质量管理类
    22.2% of total 22.2%
  • 其他(研发和技术类)
    16.7% of total 16.7%

Education

  • 大专
    61.1% of total 61.1%
  • 本科
    22.2% of total 22.2%
  • 初中
    11.1% of total 11.1%
  • 高中
    5.6% of total 5.6%

Experience

  • 1-3年
    66.7% of total 66.7%
  • 3-5年
    16.7% of total 16.7%
  • 不限
    16.7% of total 16.7%
View Detailed Analysis

What does 惠州市芯瓷半导体有限公司 require? Who is 惠州市芯瓷半导体有限公司 hiring? 招聘类别技工类占比最多占38.9%,其次是工厂生产类占33.3%。什么学历能进?大专占比最多占61.1%,其次是本科占22.2%。工作经验有什么要求?1-3年占比最多占66.7%,其次是3-5年占16.7%。工作地区在哪?惠州占比最多占94.4%,其次是金华占5.6%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 林时安
Date Established:
Credit Code: 91441322MA553FJB9N
Registered Address: 博罗县园洲镇刘屋管理区绿化北路3号

Partners & Suppliers

提供半导体封装测试服务 Source
合作客户 芯片封测
供应半导体封装设备 Source
供应商 芯片封测

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