Guangdong Fenghua Xindian Technology Co., Ltd.

Guangdong Fenghua Xindian Technology Co., Ltd. was established in 2000, with its predecessor being the "Guangdong Semiconductor Device Factory" founded in 1966. It is a high-tech enterprise specializing in the research, development, production, and sales of semiconductor devices. The company is located in Guangzhou Science City, covering an area of 30,000 square meters, with the first phase of factory buildings covering 15,000 square meters and the second phase covering 25,000 square meters, equipped with internationally advanced automated semiconductor packaging and testing production equipment. It currently employs over 630 staff, including a large number of professionals and production backbones with more than 20 years of production experience, and over 200 mid-level and senior professional personnel. The company implements ISO9001, ISO14001, and TS16949 management systems, and its products comply with RoHS environmental certification; it produces 4 billion surface-mount devices and 2 billion plug-in transistors annually; it is one of the first 94 integrated circuit enterprises encouraged for development by the state, and holds the Guangdong Provincial Engineering Technology Research and Development Center for Advanced Microelectronics Packaging and Testing; it was named China's most promising semiconductor packaging and testing enterprise in 2007, and is a Guangdong Province integrity demonstration enterprise; it is recognized as a "Guangdong Famous Trademark," "Guangdong Outstanding Independent Brand," "Guangdong Famous Brand," and one of the "Top Ten Well-Known Brands for Transistor Quality in China." The company adopts a business model combining standardized and customized services, providing SOT, TO, SOP, SSOP, and SOD series power devices and power management IC products. Currently, it is mainly developing towards high value-added, new green, environmentally friendly, and energy-saving medium and high-power devices and power management ICs. In terms of packaging forms, while consolidating the advantages of mid-range products such as SOT-23, TO-220, SOT-25, SOT-26, SOT-89, SOT-223, SOP, and SSOP series, it is focusing on developing advanced packaging such as QFN, QFP, LQFP, BGA, and CSP. In terms of application markets, while consolidating advantages in the black and white home appliances and consumer electronics markets, it is focusing on developing towards IC packaging and testing markets, computers and peripherals, network communications, automotive electronics, and electronic lighting. The company aims to become an excellent supplier of semiconductor devices and packaging and testing services.