[Summary] 工业激光芯片热沉及整体散热解决方案服务商
湃泊科技成立于2021年8月,注册资本4458万元,股东包括松山湖天使基金、深圳天使母基金、光通信上市公司及产业基金、新能源设备头部企业资源。总部坐落在东莞松山湖国际创新创业社区,主营产品是高功率芯片散热封装基座以及综合散热封装整体解决方案,是国内工业激光热沉实现IDM模式,集设计、研发与端到端全流程制造的高科技公司。
产品核心技术涵盖陶瓷预处理,PVD薄膜工艺,精细电镀,光刻蚀刻,高精密研磨抛光等。散热基板材料体系覆盖超薄氮化铝陶瓷、碳化硅和金刚石。
团队成员覆盖欧洲、日本及大陆科学家及工艺设备工程师。湃泊科技致力于成为全球不可或缺的高功率芯片散热封装解决方案提供商。
What does 东莞市湃泊科技有限公司 require? Who is 湃泊科技 hiring? 湃泊科技 recruitment: 工厂生产类占比最多占23.8%,其次是技工类占14.3%. What education can get in at 湃泊科技? 本科占比最多占70.1%,其次是大专占23.8%. High education required at 湃泊科技? 硕士占1.4%. Work experience required at 湃泊科技? 3-5年占比最多占31.3%,其次是1-3年占25.2%. Where are the job locations at 湃泊科技? 深圳占比最多占61.2%,其次是东莞占38.8%. Based on job postings from the past year, for reference only.
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