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衍梓智能专注于半导体化学薄膜沉积设备制造与配套生产工艺,公司具备完整化学薄膜沉积技术领域工程经验与相关制程工艺经验,团队由前IDM大厂全球CEO大奖及研发大奖得主牵头,团队能力涵盖制程工艺,材料,机械,能动,仿真模拟,计算机软件等。衍梓智能面向国内半导体制造厂(硅片,外延,晶圆),通过核心设备制造与再造,以及制造工艺改进(硬件+软件解决方案),提升产能、良率、一致性等一系列关键指标。

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Operating Status: 开业
Registered Capital: 292.6829万(元)
Legal Representative: 郑国
Date Established:
Credit Code: 91310120MA1HXRJ177
Registered Address: 上海市嘉定工业区叶城路912号JT17121室

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