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About the Company

[Summary] 硅光芯片设计、激光雷达、光模块、光互联、光传感

公司成立于2022年3月,总部位于上海张江科学城,是国内稀缺的硅光技术全链条解决方案商,掌握硅基CMOS工艺、Chiplet异构集成及光电共封装(CPO)核心技术,聚焦高精度光传感与高速光互联领域。联合浙江大学高等研究院在上海张江科学城成立硅基光电子人工智能联合创新中心。目前已是全球唯四的量产级硅光全产业链条开拓者,比肩国际科技巨头,成为硅光芯片*之一。

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Beeplux How Fast Is Hiring Growing? (24 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 110%
  • 2024: Down 17%
  • 2023: Up 140%
Beeplux Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Beeplux Campus Recruitment & Advanced Degree Talent Demand
Master's 8 Doctorate 2
Note: How fast is hiring at 上海孛璞半导体技术有限公司 growing? Beeplux2025年21个(增长110%),2024年10个(下降17%),2023年12个(增长140%),2022年5个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Beeplux Master's Degree Job Demand Analysis

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How fast is master's hiring at 上海孛璞半导体技术有限公司 growing? Beeplux历年硕士招聘职位量:2025年6个(增长50%),2024年4个(下降43%),2023年7个(增长40%),2022年5个. Beeplux在上海硕士人才需求中排名第436, Beeplux硕士工资大部分在30-50K以上.

Beeplux Doctoral Degree Job Demand Analysis

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+300%
Growth Rate
2026 vs 2025
Beeplux Doctoral Hiring by Year: 2026 — 3 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 上海孛璞半导体技术有限公司 growing? Beeplux历年博士招聘职位量:2026年4个(增长300%),2025年1个(增长50%). Beeplux在上海博士人才需求中排名第226, Beeplux博士工资大部分在30-50K以上.

Beeplux R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 上海孛璞半导体技术有限公司? Based on an analysis of Beeplux's job postings over the past year, “电子/电器/通信技术类”需求占64%,“计算机/网络/技术类”占36%,“其他(研发和技术类)”占14.7%,“机械/仪器仪表类”占2.7%,“电气/能源/动力类”占2.7%. For reference only.

Beeplux — What Are the Salaries Like? (75 records)

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salary range: 4.5K - 50K, 69.3% of roles pay ¥20-50K
Note: salary statistics are based on 75 salary records from the past year and depend on the job sample. For reference only.
上海孛璞半导体技术有限公司工资待遇怎么样?Beeplux69.3%的岗位拿20-50K,应届生工资¥25.0K。上海地区工资排名前25%,与同行业比+49%,电子/电器/通信技术类平均工资¥37.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of Beeplux

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Are salaries high at 上海孛璞半导体技术有限公司? We provide: 嵌入式,测试工程,软件开发,硬件,工艺工程,芯片设计,设计工程师,开发工程师,架构师,系统工程师,软件工程,网管,会计,可靠性工程师,机械设计,生产主管,系统测试,自动化,芯片测试,设计师. Click to view detailed salary analysis by job.

Beeplux honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Beeplux Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    64% of total 64%
  • 计算机/网络/技术类
    36% of total 36%
  • 质量管理类
    18.7% of total 18.7%
  • 其他(研发和技术类)
    14.7% of total 14.7%

Education

  • 本科
    54.7% of total 54.7%
  • 硕士
    36% of total 36%
  • 博士
    5.3% of total 5.3%
  • 不限
    2.7% of total 2.7%

Experience

  • 不限
    34.7% of total 34.7%
  • 5-10年
    33.3% of total 33.3%
  • 3-5年
    21.3% of total 21.3%
  • 1-3年
    9.3% of total 9.3%
View Detailed Analysis

What does 上海孛璞半导体技术有限公司 require? Who is Beeplux hiring? Beeplux招聘类别电子/电器/通信技术类占比最多占64%,其次是计算机/网络/技术类占36%。Beeplux什么学历能进?本科占比最多占54.7%,其次是硕士占36%。Beeplux学历要求高吗?硕士占36%,博士占5.3%。工作经验Beeplux有什么要求?不限占比最多占34.7%,其次是5-10年占33.3%。Beeplux工作地区在哪?上海占比最多占97.3%,其次是杭州占2.7%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 3,160.9196万(元)
Legal Representative: 郭鹏
Date Established:
Credit Code: 91310000MA7LB3QD9A
Registered Address: 中国(上海)自由贸易试验区丹桂路799号5幢709室(实际楼层6层)

Partners & Suppliers

为孛璞半导体提供封装测试服务 Source
供应商 芯片封测
为孛璞半导体提供射频芯片的晶圆代工服务 Source
供应商 芯片代工

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Beeplux Competitors (Similar Companies)

“软件产品开发商”
“集成电路芯片及产品研发商”
“光模块解决方案与服务提供商”
“专业从事非制冷红外成像与MEMS传感技术开发的高新技术企业”
“把数字世界带入每个人、每个家庭、每个组织,构建万物互联的智能世界。”
芯片设计 光电 光电子 CMOS
“我们一起创造We make it together ”
光电子 5G 光通信 物联网
传感器 半导体 光电 芯片设计
“光器件整体解决方案提供商和光电先进封装制造服务商”
“让全球每个人都能享受科技带来的美好生活”
“影像系统解决方案的创新技术”
“成为优质、创新、值得信赖的国际一流集成电路制造企业”
“专注于电子互联领域,拥有印制电路板、封装基板及电子装联三项业务”
“物联网无线通信产品和服务提供商”

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