ASE sem jobs (salary & requirements)

ASE sem salary range: 20K - 30K, where 100% of positions earn ¥20-30K

￥20-30K

100% of positions earn

Note: the average salary is analyzed based on job postings published by the company. We recommend reviewing it together with position type, education, region and experience.

ASE sem salary changes over the years

Note: the data depends on salary samples of online job postings in the corresponding years and does not fully represent the actual situation within the company. For reference only.

Education requirements: 本科 is the most common

100% 本科

What education does ASE require for sem positions? 本科占比最多，占100%

Salary by education

本科￥25.0K

ASE sem salaries by education: 本科 ¥25.0K.

Experience requirements: 3-5年 is the most common

100% 3-5年

What experience does ASE require for sem positions? 3-5年占比最多，占100%

Salary by experience

3-5年￥25.0K

ASE sem salaries by experience: 3-5年 ¥25.0K.

ASE sem hiring regions: mainly 苏州

苏州￥25.0K 100%(6)

In which cities does ASE have offices for sem positions? The main distribution is as follows: 苏州 accounts for 100%. Click this module to view the proportions of other cities, based on job postings in the past year. For reference only.

ASE sem hiring trends over the years

ASE sem changes in hiring volume over the years

What does ASE sem do

Based on related job postings of ASE in the past year

Assembly Wire Bond Engineer WB工程师(Base MLK)(J10239)
苏州-工业园区 | 3-5年 | 本科以上 | 2026-01-29
20-30k

职责描述：
1. Wire Bonding Process Development;
2.Quality Assurance;
3.Process Documentation;
4.Cross-Functional Collaboration;
5.Continuous Improvement.
任职要求：
1. Education:Bachelor;s degree in Electrical Engineering, Mechanical Engineering, Materials Science.
2.Experience:
2.1 3+ years of experience in semiconductassembly, specifically in wire bonding processes.
2.2 Hands-on experience with die attach equipment tools.
3.Soft Skills/others:
3.1 Able to communicate in English, Malay Mandarin.
More
Assembly Back End Engineer 封装后端工程师（Base MLK)(J10237)
苏州-工业园区 | 3-5年 | 本科以上 | 2026-01-29

20-30k 򀀩
Assembly Die Attach Engineer DB工程师(Base MLK)(J10238)
苏州-工业园区 | 3-5年 | 本科以上 | 2026-01-29

20-30k 򀀩
Assembly Back End Engineer 封装后端工程师（Base MLK）（J10237）
苏州-工业园区 | 3-5年 | 本科以上 | 2026-10-07

20-30k 򀀩
Assembly Die Attach Engineer DB工程师（Base MLK）（J10238）
苏州-工业园区 | 3-5年 | 本科以上 | 2026-10-07

20-30k 򀀩
Assembly Wire Bond Engineer WB工程师（Base MLK）（J10239）
苏州-工业园区 | 3-5年 | 本科以上 | 2026-10-07

？ 򀀩

苏州 sem salary

Most common salary

10-15K

vs last year

How much does 苏州 sem pay? 10-15K is the most common

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ASE sem jobs (salary & requirements)

ASE sem salary changes over the years

Education requirements: 本科 is the most common

Salary by education

Experience requirements: 3-5年 is the most common

Salary by experience

ASE sem hiring regions: mainly 苏州

ASE sem hiring trends over the years

What does ASE sem do

Assembly Wire Bond Engineer WB工程师(Base MLK)(J10239)

Assembly Back End Engineer 封装后端工程师（Base MLK)(J10237)

Assembly Die Attach Engineer DB工程师(Base MLK)(J10238)

Assembly Back End Engineer 封装后端工程师（Base MLK）（J10237）

Assembly Die Attach Engineer DB工程师（Base MLK）（J10238）

Assembly Wire Bond Engineer WB工程师（Base MLK）（J10239）

苏州 sem salary

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