ASE funding history / development milestones

股权转让，6.5亿人民币

2018.08.11, 紫光集团

Note: collected from public online reports, for reference only.

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半导体

半导体封装

芯片测试

半导体封装测试

电子制造

基板

半导体封测

晶圆

半导体测试

电子设备

电子元件

芯片封装

无线电通信

封装设计

电子电器

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光模块光通信数据通信激光通信

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矽品科技（苏州）有限公司

电子厂/电子集成电路封装半导体半导体设计

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“To develop high-quality biologics that are accessible and affordable f”

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“重塑全屋生态，打开未来智慧生活”

Schaeffler (China) Co., Ltd.

“Comprehensive supplier of automotive and industrial products”

苏州通富超威半导体有限公司

半导体芯片封装半导体制造图形处理器/GPU

BYD Company Limited

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昆山丘钛微电子科技股份有限公司

“致力于成为摄像头模组领域的技术领先、规模领先的全球行业龙头”

WUS Printed Circuit (Kunshan) Co., Ltd.

“Research, design, and manufacturing of printed circuit boards”

Bozhon Precision Technology Co., Ltd.

“Industrial equipment manufacturing and system integration”

苏州联讯仪器股份有限公司

“致力于高速光通信测试、光芯片测试和半导体测试三大领域测试仪器和设备的开发。”

苏州汇川联合动力系统股份有限公司

“智能电动汽车部件及解决方案提供商”

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