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About the Company

公司简介

合肥方晶联合半导体有限公司公司成立于2022年9月,是一家专注于功率半导体芯片的晶圆代工服务企业。公司成立以来始终坚持科技强企、质量强企、人才强企,文化强企战略,始终沿着标准化、程序化、正规化、现代化的方向良性发展,强调尊重客户、服务客户的理念,并深化建设提升自身管理标准回馈社会大众的企业文化,配合安徽省“十四五”发展规划,贯彻“芯”“车”协同发展策略,推动国内汽车产业升级。

方晶以110纳米制程工艺为主,为客户提供 Trench MOSFET、SGT MOSFET、Super Junction MOSFET、IGBT等功率半导体晶圆制造、晶背减薄、晶圆测试 等优质的代工服务。主要应用终端有消费电子、家电、工业电子、光伏新能源、通讯电源及汽车电子等领域。

方晶拥有强大的工程技术团队,来自中国台湾及国内的各大晶圆厂,管理团队及研发团队在同行业内拥有10年以上管理和技术经验,力争为客户提供更优质的服务,创造更卓越的价值,同时努力推动国产汽车全产业链发展,加速实现国产汽车功率芯片自给自足的目标

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Business Registration

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Operating Status: 开业
Registered Capital: 8,000万(元)
Legal Representative: 黄晋德
Date Established:
Credit Code: 91340100MA8PF7558E
Registered Address: 合肥市新站区东方大道与大禹路交口综保大厦9层909室

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