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Company Overview

Development Stage

About the Company

德信芯片是一家半导体芯片生产商,主要产品聚焦于高端功率半导体芯片,产品品类包括但不限于瞬态抑制二极管、快速恢复二极管,以及各种新能源汽车行业需要的芯片。

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德信芯片 Financing History (1 rounds)

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战略投资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 2.8亿人民币
  • Investor: 中新创投,广汽集团,泰达科...

德信芯片 How Fast Is Hiring Growing? (11 open positions)

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Note: How fast is hiring at 苏州德信芯片科技有限公司 growing? 德信芯片2025年9个(下降79%),2024年43个(增长2050%),2023年2个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

德信芯片 — What Are the Salaries Like? (22 records)

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德信芯片 Salary Overview
salary range: 8K - 50K, 81.8% of roles pay ¥15-50K
Note: salary statistics are based on 22 salary records from the past year and depend on the job sample. For reference only.
苏州德信芯片科技有限公司工资待遇怎么样?德信芯片81.8%的岗位拿15-50K,本科工资¥。苏州地区工资排名前10%,与同行业比+74%,技工类平均工资¥32.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 德信芯片

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Are salaries high at 苏州德信芯片科技有限公司? We provide: 设备工,工艺工程,工艺主管,电气,dcc,erp,mes,会计,工艺经理,市场,总账,文控,水工,电工,财务,资深工程师,采购,量测工程师,销售,项目申报. Click to view detailed salary analysis by job.

德信芯片 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

德信芯片 Related Industry Tags

Job Category

  • 技工类
    36.4% of total 36.4%
  • 工厂生产类
    27.3% of total 27.3%
  • 经营管理类
    27.3% of total 27.3%
  • 机械/仪器仪表类
    22.7% of total 22.7%

Education

  • 本科
    68.2% of total 68.2%
  • 大专
    31.8% of total 31.8%

Experience

  • 不限
    100% of total 100%
View Detailed Analysis

What does 苏州德信芯片科技有限公司 require? Who is 德信芯片 hiring? 德信芯片招聘类别技工类占比最多占36.4%,其次是工厂生产类占27.3%。德信芯片什么学历能进?本科占比最多占68.2%,其次是大专占31.8%。工作经验德信芯片有什么要求?不限占比最多占100%。德信芯片工作地区在哪?苏州占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 52,800万(元)
Legal Representative: 周坚
Date Established:
Credit Code: 91320505MA7JK28Q56
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区东长路88号D1幢1层B35-6室

Partners & Suppliers

为其提供车规级功率器件晶圆代工服务 Source
供应商 晶圆代工

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德信芯片 Competitors (Similar Companies)

电子厂/电子 微电子 芯片制造 芯片
“半导体领域技术开发与服务商”
半导体 芯片 激光芯片 光芯片
“一家专业从事CMOS影像传感器设计、研发和市场销售的高科技公司”
电子厂/电子 微电子 集成电路 集成电路设计
“微电子产业集团”
““光”与“感测”相关半导体组件开发商”
半导体封装 半导体分立器件 分立器件 封装
“半导体芯片的研发、生产、销售和服务。”
电子厂/电子 微电子 半导体 生产
“工业自动化和能源电力领域的产品与服务提供者”
摄像头 充电线 掌上电脑 仪器/仪表
电子厂/电子 MID产品 IC 半导体
EMS 仪器/仪表 测试设备 工业自动化
电子厂/电子 触摸屏 电容 背光源

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