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Development Stage

About the Company

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Business Registration

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Operating Status: 开业
Registered Capital: 77,300万(元)
Legal Representative: 饶轶
Date Established:
Credit Code: 91310000MAC3FPQK07
Registered Address: 中国(上海)自由贸易试验区临港新片区平霄路299号

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Partners & Suppliers

晶方科技为舜宇奥来提供晶圆级封装服务,共同开发3D传感封装技术 Source
供应商 半导体封装

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