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Company Overview

Development Stage

About the Company

[Summary] 一家致力于开发与创新新技术,为客户提供可靠的,小型化,高性能和高性价比的半导体封装量产服务商。

晶方科技是一家半导体芯片封装测试公司,是大规模提供晶圆级芯片尺寸封装(WLCSP)量产技术的高科技公司。

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Information is aggregated from the web and may not be exact. For reference only.
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晶方科技 Financing History (4 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market: 主板
  • Deal: 上交所

晶方科技 How Fast Is Hiring Growing? (8 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 140%
  • 2024: Down 44%
  • 2023: Down 74%
  • 2022: Down 61%
晶方科技 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 苏州晶方半导体科技股份有限公司 growing? 晶方科技2025年12个(增长140%),2024年5个(下降44%),2023年9个(下降74%),2022年34个(下降61%),2021年88个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

晶方科技 — What Are the Salaries Like? (13 records)

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晶方科技 Salary Overview
salary range: 4.5K - 50K, 92.3% of roles pay ¥8-50K
Note: salary statistics are based on 13 salary records from the past year and depend on the job sample. For reference only.
苏州晶方半导体科技股份有限公司工资待遇怎么样?晶方科技92.3%的岗位拿8-50K,本科工资¥。与同行业比-9%,质量管理类平均工资¥16.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

晶方科技 honors, qualifications & industry associations

晶方科技 Related Industry Tags

Job Category

  • 质量管理类
    30.8% of total 30.8%
  • 经营管理类
    23.1% of total 23.1%
  • 人力资源类
    15.4% of total 15.4%
  • 电子/电器/通信技术类
    15.4% of total 15.4%

Education

  • 本科
    84.6% of total 84.6%
  • 高中
    7.7% of total 7.7%
  • 大专
    7.7% of total 7.7%

Experience

  • 不限
    69.2% of total 69.2%
  • 3-5年
    23.1% of total 23.1%
  • 5-10年
    7.7% of total 7.7%
View Detailed Analysis

What does 苏州晶方半导体科技股份有限公司 require? Who is 晶方科技 hiring? 晶方科技招聘类别质量管理类占比最多占30.8%,其次是经营管理类占23.1%。晶方科技什么学历能进?本科占比最多占84.6%,其次是高中占7.7%。工作经验晶方科技有什么要求?不限占比最多占69.2%,其次是3-5年占23.1%。晶方科技工作地区在哪?苏州占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 65,217.1706万(元)
Legal Representative: 王蔚
Date Established:
Credit Code: 913200007746765307
Registered Address: 苏州工业园区汀兰巷29号

Partners & Suppliers

供应晶圆级封装用掩膜版 Source
供应商 半导体封装
采购电镀液及配套试剂用于半导体封装 Source
供应商 集成电路封装
晶方科技为睿镞科技提供激光雷达传感器的晶圆级封装服务。 Source
合作客户 半导体封装
其为亿波达提供晶圆级封装服务 Source
合作客户 封装测试
晶方科技为豪威半导体(绍兴)提供晶圆级封装测试服务 Source
合作客户 封测服务

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晶方科技 Competitors (Similar Companies)

“半导体封装测试生产厂家之一”
半导体 半导体封装 芯片 芯片制造
“信号链芯片及其解决方案提供商”
“半导体封测知名企业”
“从事精密薄膜光学及延伸产品研发、生产和销售的知名光电元器件制造企业”
“成为优质、创新、值得信赖的国际一流集成电路制造企业”
“成为领先的智能制造解决方案供应商,为客户提供额外的价值”
半导体 芯片封装 半导体制造 图形处理器
电子厂/电子 微电子 集成电路封装测试 封装测试
“立志成为射频领域国际顶尖企业,为移动智能终端厂商提供全方位射频解决方案。 ”
“一家高科技集成电路芯片代工企业”
“把数字世界带入每个人、每个家庭、每个组织,构建万物互联的智能世界。”
“建设一个富足非凡的世界”
“为机器植入眼睛和大脑,赋能光速互联,创造和实现客户梦想”
“ 追求卓越品质,培养有用人才,创造社会财富。”

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