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About the Company

[Summary] 半导体封测先导技术研发商

 关于我们
华进半导体封装先导技术研发中心有限公司于2012年9月在无锡新区正式注册成立。公司目前共有十家股东,分别是中科院微电子所、长电科技、通富微电、华天科技、深南电路、苏州晶方、安捷利、无锡中科物联、兴森快捷、国开发展基金。

 公司定位
提高我国封测产业技术创新能力和核心竞争力,持续带动具有中国特色半导体封测产业链和价值链的发展,为打造我国*封测企业提供技术支撑,同时提高我国半导体封测产业在国际半导体产业格局中的话语权和地位,培养具有国际视野的人才团队。

 行业地位
 国家集成电路特色工艺及封装测试创新中心
 国家集成电路封测产业链技术创新战略联盟半导体封装先导技术研发中心、副理事长单位
 国家发改委高密度集成电路封装技术国家工程实验室
 国家发改委和教育部“创新微电子学院”——集成封测实习基地、“双创基地”
 江苏省产业技术研究院半导体封装技术研究所
 江苏省先进封装与系统集成制造业创新中心
 江苏省半导体行业协会常务理事单位

 人才队伍
公司团队规模200余人,专职研发人员140余人,其中一半以上具有博士学位和硕士学位,高级职称20余人。
先后引进国家重大人才工程专家(8名)、中科院*人才(2名)、江苏省“双创人才”(5名)、江苏省“JITRI研究员”(2名)、海外归国人才20余名。
管理团队由具有国际知名企业或研发机构长期技术和管理经验的人才,与具有丰富研发经验的本土团队成员所组成。员工主体来自中国科学院微电子研究所和国内主流芯片制造或封装企业,具有丰富的技术研发和量产经验。

企业文化
华进精神:合作、创新、进取、卓yue
华进愿景:国际yi流的封装与系统集成先导技术研发与产业中心
华进使命:创新——引领微电子封装与系统集成技术发展
应用——规模化成套技术转让能力
影响——推动国内外产学研用合作
带动——推动微电子封装产业全方位生态系统

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Information is aggregated from the web and may not be exact. For reference only.
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华进半导体 Financing History (6 rounds)

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战略投资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 5.15亿人民币
  • Investor: 工商银行

华进半导体 How Fast Is Hiring Growing? (30 open positions)

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Note: How fast is hiring at 华进半导体封装先导技术研发中心有限公司 growing? 华进半导体2026: 54 openings (up 42%), 2025: 38 openings (down 30%), 2024: 54 openings (down 5%), 2023: 57 openings (up 119%), 2022: 26 openings (down 61%), 2021: 67 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

华进半导体 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Down 56%
  • 2024: Up 125%
  • 2023: Up 33%
  • 2022: Down 25%
华进半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 华进半导体封装先导技术研发中心有限公司 growing? 华进半导体Master's recruitment over the years: 2025: 4 openings (down 56%), 2024: 9 openings (up 125%), 2023: 4 openings (up 33%), 2022: 3 openings (down 25%), 2021: 4 openings.

华进半导体 Doctoral Degree Job Demand Analysis

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-33%
Growth Rate
2026 vs 2025
  • 2025: Up 200%
华进半导体 Doctoral Hiring by Year: 2026 — 1 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 华进半导体封装先导技术研发中心有限公司 growing? 华进半导体Doctorate recruitment over the years: 2026: 2 openings (down 33%), 2025: 3 openings (up 200%), 2024: 1 openings.

华进半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 华进半导体封装先导技术研发中心有限公司? Based on an analysis of 华进半导体's job postings over the past year, "其他(研发和技术类)" demand: 23.6%, "电子/电器/通信技术类": 12.5%, "机械/仪器仪表类": 6.9%, "电气/能源/动力类": 6.9%, "生物/制药/化工/环保类": 2.8%, "科研类": 1.4%. For reference only.

华进半导体 — What Are the Salaries Like? (72 records)

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salary range: 4.5K - 50K, 58.3% of roles pay ¥15-30K
Note: salary statistics are based on 72 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 华进半导体封装先导技术研发中心有限公司?华进半导体58.3% of positions earn 15-30K, Fresh graduate salary: ¥17.5K。Wuxi salary ranking top 25,工厂生产类 average salary ¥17.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 华进半导体

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Are salaries high at 华进半导体封装先导技术研发中心有限公司? We provide: 工艺工程,研发工程师,销售,pi,设计工程师,cpo,设备工,仓库,会计,工程总,总账,暖通,质量,od,分析,厂务,土建,法务,生产主管,生产技术. Click to view detailed salary analysis by job.

华进半导体 — Fortune 500? (More)

Yes, ranked in 中国专利实力500强:

华进半导体 honors, qualifications & industry associations

华进半导体 Related Industry Tags

Job Category

  • 工厂生产类
    26.4% of total 26.4%
  • 其他(研发和技术类)
    23.6% of total 23.6%
  • 技工类
    19.4% of total 19.4%
  • 电子/电器/通信技术类
    12.5% of total 12.5%

Education

  • 本科
    66.7% of total 66.7%
  • 硕士
    13.9% of total 13.9%
  • 大专
    11.1% of total 11.1%
  • 博士
    6.9% of total 6.9%

Experience

  • 不限
    56.9% of total 56.9%
  • 3-5年
    22.2% of total 22.2%
  • 5-10年
    12.5% of total 12.5%
  • 1-3年
    6.9% of total 6.9%
View Detailed Analysis

What does 华进半导体封装先导技术研发中心有限公司 require? Who is 华进半导体 hiring? 华进半导体 recruitment: 工厂生产类占比最多占26.4%,其次是其他(研发和技术类)占23.6%. What education can get in at 华进半导体? 本科占比最多占66.7%,其次是硕士占13.9%. High education required at 华进半导体? 硕士占13.9%,博士占6.9%. Work experience required at 华进半导体? 不限占比最多占56.9%,其次是3-5年占22.2%. Where are the job locations at 华进半导体? 无锡占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 72,064.22万(元)
Legal Representative: 汤树军
Date Established:
Credit Code: 913202130551581209
Registered Address: 无锡市新吴区新安街道景贤路2号

Partners & Suppliers

与兴森科技合作开发先进封装基板技术 Source
合作客户 技术研发合作
华进半导体与清华大学在封装测试领域有技术合作 Source
供应商 高校/研究院
华进半导体与北京大学合作进行先进封装材料与工艺研究 Source
供应商 高校/研究院
华进半导体与中科院微电子所共建联合实验室,开展封装技术研究 Source
供应商 高校/研究院
华进半导体使用华大九天的EDA工具进行封装设计 Source
供应商 EDA软件

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