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Company Overview

Development Stage

About the Company

江苏路芯半导体技术有限公司总投资20亿元,公司位于苏州市工业园区胜浦路177号,占地面积超4万5千平米。园区包括研发中心、制造中心、营销中心。项目建设高精度集成电路用光掩膜版生产线。
未来,江苏路芯将实现半导体产业关键原材料-掩膜版的国产化、本土化,完善国内半导体产业链,助力提升我国在全球半导体产业的地位。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (22 open positions)

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Note: How fast is hiring at 江苏路芯半导体技术有限公司 growing? 2025年16个(增长45%),2024年11个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (28 records)

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salary range: 6K - 50K, 57.1% of roles pay ¥10-20K
Note: salary statistics are based on 28 salary records from the past year and depend on the job sample. For reference only.
江苏路芯半导体技术有限公司工资待遇怎么样?57.1%的岗位拿10-20K,应届生工资¥8.0K。与同行业比-17%,工厂生产类平均工资¥12.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 江苏路芯半导体技术有限公司? We provide: 质量,工艺工程,销售,设备工,ce工程师,qe,人力,体系工程师,储备干部,制程工程师,制造工程师,助理工程,厂务,大客户,安检,数据处理,气化技术员,水处理,生产计划,研发工程师. Click to view detailed salary analysis by job.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 工厂生产类
    28.6% of total 28.6%
  • 技工类
    21.4% of total 21.4%
  • 质量管理类
    21.4% of total 21.4%
  • 生物/制药/化工/环保类
    10.7% of total 10.7%

Education

  • 本科
    67.9% of total 67.9%
  • 大专
    25% of total 25%
  • 高中
    7.1% of total 7.1%

Experience

  • 3-5年
    35.7% of total 35.7%
  • 不限
    28.6% of total 28.6%
  • 1-3年
    14.3% of total 14.3%
  • 5-10年
    14.3% of total 14.3%
View Detailed Analysis

What does 江苏路芯半导体技术有限公司 require? Who is 江苏路芯半导体技术有限公司 hiring? 招聘类别工厂生产类占比最多占28.6%,其次是技工类占21.4%。什么学历能进?本科占比最多占67.9%,其次是大专占25%。工作经验有什么要求?3-5年占比最多占35.7%,其次是不限占28.6%。工作地区在哪?苏州占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 54,500万(元)
Legal Representative: 孙学军
Date Established:
Credit Code: 91320594MACKBAX63Y
Registered Address: 中国(江苏)自由贸易试验区苏州片区苏州工业园区胜浦路177号

Partners & Suppliers

联合研发先进光刻胶材料 Source
合作客户 研发合作
提供光刻胶用于光刻机测试和验证 Source
合作客户 半导体设备
供应光刻胶产品,用于DRAM制造 Source
合作客户 存储芯片
供应光刻胶产品,用于3D NAND闪存制造 Source
合作客户 存储芯片
供应光刻胶产品,用于晶圆制造 Source
合作客户 芯片代工/制造

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Competitors (Similar Companies)

半导体 芯片设计 芯片 光通信
“电子信息专用材料研发生产商”
“专致于光传输领域的光学产品研发和制造的高新企业”
“光电器件及相关材料制造商”
半导体 化合物半导体 第三代半导体 导体材料
“芯片研发、设计、制造、应用的集成电路全产业链”
“激光防伪印刷材料”
“医疗器械研发商”
“致力于成为全球半导体设备行业首梯队的技术提供者”
集成电路 半导体 电子 电子元件
半导体 光掩模 IC 研发
研发 半导体 国有资本
电力 电力设备 齿轮 齿轮箱
光学 光电 半导体 工业智能化
微电子 半导体 硬件 电子设备

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