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Company Overview

Development Stage

About the Company

崴思半导体材料(苏州)有限公司成立于2023年9月,是主要生产电子、半导体行业所用的特种薄膜,公司致力于产品的自主开发以适应高端薄膜国产化的需求,我们的客户是电子和半导体行业的佼佼者,公司注重企业与员工的共同成长,我们共同打造成功企业,奉献社会,成就自我。

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How Fast Is Hiring Growing? (6 open positions)

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Note: How fast is hiring at 崴思半导体材料(苏州)有限公司 growing? 2025: 18 openings (up 1700%), 2024: 1 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (13 records)

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salary range: 4.5K - 50K, 61.6% of roles pay ¥6-10K
Note: salary statistics are based on 13 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 崴思半导体材料(苏州)有限公司?61.6% of positions earn 6-10K, Undergraduate salary: ¥。技工类 average salary ¥8.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

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Job Category

  • 技工类
    38.5% of total 38.5%
  • 其他(研发和技术类)
    23.1% of total 23.1%
  • 机械/仪器仪表类
    23.1% of total 23.1%
  • 客户服务类
    15.4% of total 15.4%

Education

  • 本科
    61.5% of total 61.5%
  • 高中
    23.1% of total 23.1%
  • 大专
    7.7% of total 7.7%
  • 不限
    7.7% of total 7.7%

Experience

  • 不限
    53.8% of total 53.8%
  • 1-3年
    23.1% of total 23.1%
  • 3-5年
    15.4% of total 15.4%
  • 5-10年
    7.7% of total 7.7%
View Detailed Analysis

What does 崴思半导体材料(苏州)有限公司 require? Who is 崴思半导体材料(苏州)有限公司 hiring? recruitment: 技工类占比最多占38.5%,其次是其他(研发和技术类)占23.1%. What education can get in at ? 本科占比最多占61.5%,其次是高中占23.1%. Work experience required at ? 不限占比最多占53.8%,其次是1-3年占23.1%. Where are the job locations at ? 苏州占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 2,000万(元)
Legal Representative: 季成华
Date Established:
Credit Code: 91320506MACU93RF85
Registered Address: 苏州市吴中区木渎镇七子路12号金地威新吴中智造园2幢101,201

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