Rayson Technology funding history / development milestones

Pre-IPO，

2025.01.16，

B轮，数亿人民币

2022.08.09, 华强创投

Note: collected from public online reports, for reference only.

Talent Demand Trend Analysis More

存储芯片

EMCP

EMMC

DDR3

封装

嵌入式控制器

处理器芯片

封测

芯片

半导体

芯片设计

存储解决方案

存储产品

物联网/IoT

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