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Company Overview

Development Stage

About the Company

玻芯成是一家专注于玻璃基高可靠性半导体产品及玻璃封装基板的研发、生产、销售的高科技企业,建设玻璃基半导体特色工艺线,充分发挥设备、材料、工艺整合优势,致力于提供高性能高密互联的玻璃封装基板、集成无源器件、微机电、光电共封器件及系统集成解决方案。产品主要面向工业控制、汽车电子、电力能源等领域。

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How Fast Is Hiring Growing? (43 open positions)

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Note: How fast is hiring at 玻芯成(重庆)半导体科技有限公司 growing? 2025年59个(增长168%),2024年22个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 玻芯成(重庆)半导体科技有限公司 growing? 历年硕士招聘职位量:2025年10个(增长400%),2024年2个. 玻芯成(重庆)半导体科技有限公司在重庆硕士人才需求中排名第205, 玻芯成(重庆)半导体科技有限公司硕士工资大部分在10-20K.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 玻芯成(重庆)半导体科技有限公司? Based on an analysis of 's job postings over the past year, “电子/电器/通信技术类”需求占26.5%,“生物/制药/化工/环保类”占23%,“计算机/网络/技术类”占14.2%,“其他(研发和技术类)”占13.3%,“机械/仪器仪表类”占3.5%,“电气/能源/动力类”占1.8%. For reference only.

— What Are the Salaries Like? (113 records)

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salary range: 2K - 50K, 52.2% of roles pay ¥15-30K
Note: salary statistics are based on 113 salary records from the past year and depend on the job sample. For reference only.
玻芯成(重庆)半导体科技有限公司工资待遇怎么样?52.2%的岗位拿15-30K,应届生工资¥16.5K。重庆地区工资排名第265,与同行业比+68%,技工类平均工资¥21.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 玻芯成(重庆)半导体科技有限公司? We provide: 工艺工程,行政,销售,仿真工程师,pv,中级工程师,质量,前台,污水技术员,环保,ie,pi,产品工程,电镀,管培生,设备工,设备高级工程师,采购,项目申报,pe. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 技工类
    32.5% of total 32.5%
  • 电子/电器/通信技术类
    26.3% of total 26.3%
  • 生物/制药/化工/环保类
    22.8% of total 22.8%
  • 工厂生产类
    20.2% of total 20.2%

Education

  • 本科
    77.2% of total 77.2%
  • 硕士
    13.2% of total 13.2%
  • 大专
    5.3% of total 5.3%
  • 不限
    2.6% of total 2.6%

Experience

  • 5-10年
    47.4% of total 47.4%
  • 3-5年
    21.1% of total 21.1%
  • 不限
    14% of total 14%
  • 1-3年
    12.3% of total 12.3%
View Detailed Analysis

What does 玻芯成(重庆)半导体科技有限公司 require? Who is 玻芯成(重庆)半导体科技有限公司 hiring? 招聘类别技工类占比最多占32.5%,其次是电子/电器/通信技术类占26.3%。什么学历能进?本科占比最多占77.2%,其次是硕士占13.2%。学历要求高吗?硕士占13.2%,博士占1.8%。工作经验有什么要求?5-10年占比最多占47.4%,其次是3-5年占21.1%。工作地区在哪?重庆占比最多占78.1%,其次是上海占21.9%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,367.762万(元)
Legal Representative: 徐洪光
Date Established:
Credit Code: 91310106MA1FYTHT2D
Registered Address: 重庆市涪陵区马鞍街道盘龙路17号C厂房

Partners & Suppliers

产学研合作,共建功率半导体联合实验室 Source
供应商 高校/研究院合作
车规级IGBT模块供应商,玻芯成向长安汽车供应IGBT模块用于新能源汽车 Source
合作客户 汽车电子
封装测试服务,为玻芯成的功率半导体器件提供封装和测试 Source
供应商 芯片封测
晶圆代工服务,为玻芯成提供IGBT和MOSFET产品的晶圆制造 Source
供应商 芯片代工

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