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Company Overview

Development Stage

  • Stage: 天使轮,近亿人民币。
  • Ranking: Ranked #151 in 北京设计服务公司 by popularity
  • Honors: 科技型中小企业 市科技型中小企业 According to algorithm
  • Salary: 71.8%的岗位拿20-50K,2026年较去年下降10%。硕士工资¥45.0K。
  • R&D: “电子/电器/通信技术类”需求占60.9%,“计算机/网络/技术类”占56.5%,“其他(研发和技术类)”占17.4%。
  • Recruiting: 2026年较2025年增长129%。高学历人才:硕士1个。
  • Requirement: 学历:本科最多,占78.3%。经验:5-10年最多,占54.3%。
  • Region: 分布在1个地区,北京占91.3%,南京占8.7%。

About the Company

北京芯升半导体科技有限公司成立于2024年12月,公司技术团队均在以太网通信芯片领域具备10年以上的研发经验,具备从10G~200G等工业级及车规级交换及PHY芯片研发的全流程经验,以华为海思和IP产品线背景为主,聚集Broadcom、MARVELL、NXP、VxWorks及主流车厂智驾团队优秀人才,专注于车载以太网TSN及下一代车载光纤网络通信芯片及解决方案,通过低成本、高可靠、易用性强的车载通信芯片及解决方案,助力汽车智能化演进。公司主要业务涉及车载TSN网络通信芯片、车载光纤网络通信芯片及智能网络控制芯片设计、TSN网络架构及软件仿真测试平台设计,致力于成为*的时敏通信芯片及解决方案提供商。

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芯升半导体 Financing History (1 rounds)

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天使轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 近亿人民币
  • Investor: 中关村启航基金,陆石投资,...

芯升半导体 Recruitment Overview / Current Status (4 open positions)

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Note: How fast is hiring at 北京芯升半导体科技有限公司 growing? 芯升半导体2026年32个,2025年14个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

芯升半导体 Master's Degree Job Demand Analysis

(More)
-33%
Growth Rate
2026 vs 2025
芯升半导体 Master's Hiring by Year: 2026 — 2 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 北京芯升半导体科技有限公司 growing? 芯升半导体历年硕士招聘职位量:2026年4个,2025年6个.

芯升半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 北京芯升半导体科技有限公司? Based on an analysis of 芯升半导体's job postings over the past year, “电子/电器/通信技术类”需求占60.9%,“计算机/网络/技术类”占56.5%,“其他(研发和技术类)”占17.4%,“生物/制药/化工/环保类”占10.9%,“科研类”占4.3%. For reference only.

芯升半导体 — What Are the Salaries Like? (46 records)

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芯升半导体 Salary Overview
salary range: 15K - 50K, 71.8% of roles pay ¥20-50K
Note: salary statistics are based on 46 salary records from the past year and depend on the job sample. For reference only.
北京芯升半导体科技有限公司工资待遇怎么样?芯升半导体71.8%的岗位拿20-50K,本科工资¥。北京地区工资排名前15%,与同行业比+138%,电子/电器/通信技术类平均工资¥39.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 芯升半导体

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Are salaries high at 北京芯升半导体科技有限公司? We provide: 前端,设计工程师,开发工程师,架构师,fpga,系统工程师,验证工程师,sd,测试工程,芯片测试,软件架构,发展总监,嵌入式,硬件,财务,软件工程,软件开发,销售,项目经理,ic设计. Click to view detailed salary analysis by job.

芯升半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

芯升半导体 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 电子/电器/通信技术类
    60.9% of total 60.9%
  • 计算机/网络/技术类
    56.5% of total 56.5%
  • 其他(研发和技术类)
    17.4% of total 17.4%
  • 生物/制药/化工/环保类
    10.9% of total 10.9%

Education

  • 本科
    78.3% of total 78.3%
  • 硕士
    21.7% of total 21.7%

Experience

  • 5-10年
    54.3% of total 54.3%
  • 3-5年
    30.4% of total 30.4%
  • 不限
    13% of total 13%
  • 1-3年
    2.2% of total 2.2%
View Detailed Analysis

What does 北京芯升半导体科技有限公司 require? Who is 芯升半导体 hiring? 芯升半导体招聘类别电子/电器/通信技术类占比最多占60.9%,其次是计算机/网络/技术类占56.5%。芯升半导体什么学历能进?本科占比最多占78.3%,其次是硕士占21.7%。芯升半导体学历要求高吗?硕士占21.7%。工作经验芯升半导体有什么要求?5-10年占比最多占54.3%,其次是3-5年占30.4%。芯升半导体工作地区在哪?北京占比最多占91.3%,其次是南京占8.7%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,400万(元)
Legal Representative: 徐俊亭
Date Established:
Credit Code: 91110108MAE757P201
Registered Address: 北京市海淀区中关村南大街5号二区683号楼9层918-19

Talent Demand Trend Analysis More

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芯升半导体 Competitors (Similar Companies)

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车联网 物联网 车载通信 汽车智能化
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“传递信息技术、成就客户梦想”
信息安全 系统集成 虚拟化 城域网
“致力于向全球各大通信设备和系统解决方案供应商”
物联网 机器视觉 信息安全 智慧园区

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