Company Overview

Development Stage

About the Company

瑞发科半导体(天津)股份有限公司创立于2009年,总部位于天津市。瑞发科专注于高速互连芯片的研发、设计和销售,基于SerDes技术领域长期技术创新与积累,打造了一系列具备自主知识产权的高速互连芯片产品,已在智能汽车、消费电子等领域实现规模化应用,正积极向智能机器人、低空飞行器等对高速互连具备高需求的新兴场景拓展。公司秉承“以自主创芯,连接未来世界”的企业愿景,坚持“技术立企、标准引领、产品优质、生态共赢”的可持续发展战略,致力于成为*的高速互连芯片及解决方案提供商,成为我国数字时代万物互连“运力网络”构建的重要力量。

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瑞发科半导体 Financing History (4 rounds)

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战略投资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 数千万人民币
  • Investor: 长安汽车,国开金融-国开开...

瑞发科半导体 How Fast Is Hiring Growing? (80 open positions)

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Note: How fast is hiring at 瑞发科半导体(天津)股份有限公司 growing? 瑞发科半导体2026: 105 openings (up 9%), 2025: 96 openings (up 317%), 2024: 23 openings (up 10%), 2023: 21 openings (down 38%), 2022: 34 openings (up 100%), 2021: 17 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

瑞发科半导体 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 109%
  • 2024: Up 10%
  • 2023: Down 52%
  • 2022: Up 50%
瑞发科半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 瑞发科半导体(天津)股份有限公司 growing? 瑞发科半导体Master's recruitment over the years: 2025: 23 openings (up 109%), 2024: 11 openings (up 10%), 2023: 10 openings (down 52%), 2022: 21 openings (up 50%), 2021: 14 openings.

瑞发科半导体 Doctoral Degree Job Demand Analysis

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+100%
Growth Rate
2026 vs 2025
瑞发科半导体 Doctoral Hiring by Year: 2026 — 2 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 瑞发科半导体(天津)股份有限公司 growing? 瑞发科半导体Doctorate recruitment over the years: 2026: 4 openings (up 100%), 2025: 2 openings (up 109%).

瑞发科半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 瑞发科半导体(天津)股份有限公司? Based on an analysis of 瑞发科半导体's job postings over the past year, "电子/电器/通信技术类" demand: 52.1%, "其他(研发和技术类)": 27.1%, "计算机/网络/技术类": 25.7%, "生物/制药/化工/环保类": 8.3%, "电气/能源/动力类": 4.9%, "科研类": 3.5%. For reference only.

瑞发科半导体 — What Are the Salaries Like? (144 records)

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salary range: 4.5K - 50K, 64.6% of roles pay ¥20-50K
Note: salary statistics are based on 144 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 瑞发科半导体(天津)股份有限公司?瑞发科半导体64.6% of positions earn 20-50K, Fresh graduate salary: ¥24.8K。Tianjin salary ranking top 10,电子/电器/通信技术类 average salary ¥31.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 瑞发科半导体

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Are salaries high at 瑞发科半导体(天津)股份有限公司? We provide: 设计工程师,电路设计,硬件,运维,验证工程师,ae,芯片设计,销售,ux,电路工程师,软件工程,fa,ic验证,应用工程师,测试工程,质量,大客户,文档工程师,版图工程师,证券. Click to view detailed salary analysis by job.

瑞发科半导体 honors, qualifications & industry associations

瑞发科半导体 Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    52.3% of total 52.3%
  • 其他(研发和技术类)
    27.2% of total 27.2%
  • 计算机/网络/技术类
    24.5% of total 24.5%
  • 质量管理类
    13.2% of total 13.2%

Education

  • 本科
    55.6% of total 55.6%
  • 硕士
    39.1% of total 39.1%
  • 博士
    4% of total 4%
  • 大专
    1.3% of total 1.3%

Experience

  • 3-5年
    26.5% of total 26.5%
  • 应届生
    24.5% of total 24.5%
  • 不限
    23.2% of total 23.2%
  • 1-3年
    15.9% of total 15.9%
View Detailed Analysis

What does 瑞发科半导体(天津)股份有限公司 require? Who is 瑞发科半导体 hiring? 瑞发科半导体 recruitment: 电子/电器/通信技术类占比最多占52.3%,其次是其他(研发和技术类)占27.2%. What education can get in at 瑞发科半导体? 本科占比最多占55.6%,其次是硕士占39.1%. High education required at 瑞发科半导体? 硕士占39.1%,博士占4%. Work experience required at 瑞发科半导体? 3-5年占比最多占26.5%,其次是应届生占24.5%. Where are the job locations at 瑞发科半导体? 天津占比最多占87.4%,其次是上海占8.6%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 7,000万(元)
Legal Representative: 王元龙
Date Established:
Credit Code: 911201166906845097
Registered Address: 天津滨海高新区华苑产业区开华道22号5号楼西塔11层

Partners & Suppliers

中兴通讯使用瑞发科的模拟芯片产品 Source
合作客户 终端设备
vivo在其充电器中采用了瑞发科的芯片方案 Source
合作客户 终端设备
OPPO采购瑞发科的快充芯片用于其手机配件 Source
合作客户 终端设备
小米使用瑞发科的USB-C接口芯片或电源管理芯片 Source
合作客户 终端设备
华为采用瑞发科的快充协议芯片用于手机充电器 Source
合作客户 终端设备

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“Mobile phone brand in African countries”
半导体 集成电路制造 芯片设计 集成电路设计

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