Company Overview

Development Stage

About the Company

 合肥产投旗下碳化硅功率半导体IDM企业
 专注于碳化硅功率半导体产品的设计、生产和销售,为高功率密
度电能转换系统提供完整的半导体解决方案
 主要产品为SiCSBD、SiCMOSFET和SiC模块
 技术和产业化经验丰富,深耕功率半导体

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Information is aggregated from the web and may not be exact. For reference only.
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Recruitment Overview / Current Status (62 open positions)

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Note: How fast is hiring at 芯合半导体(合肥)有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 芯合半导体(合肥)有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 39.6%, "计算机/网络/技术类": 19.8%, "其他(研发和技术类)": 17.9%, "机械/仪器仪表类": 16%, "电气/能源/动力类": 7.5%, "生物/制药/化工/环保类": 3.8%. For reference only.

— What Are the Salaries Like? (106 records)

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salary range: 3K - 50K, 76.4% of roles pay ¥20-50K
Note: salary statistics are based on 106 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 芯合半导体(合肥)有限公司?76.4% of positions earn 20-50K, Undergraduate salary: ¥。Beijing salary ranking: #620,电子/电器/通信技术类 average salary ¥34.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 芯合半导体(合肥)有限公司? We provide: ae,销售,fa,产品经理,资深工程师,工艺工程,应用工程师,设备经理,算法,设备工,ba,qe,结构工程,质量,采购,ye工程师,信息,安全,市场,总经理. Click to view detailed salary analysis by job.

Related Industry Tags

Job Category

  • 电子/电器/通信技术类
    39.6% of total 39.6%
  • 计算机/网络/技术类
    19.8% of total 19.8%
  • 其他(研发和技术类)
    17.9% of total 17.9%
  • 机械/仪器仪表类
    16% of total 16%

Education

  • 本科
    81.1% of total 81.1%
  • 大专
    12.3% of total 12.3%
  • 硕士
    3.8% of total 3.8%
  • 不限
    2.8% of total 2.8%

Experience

  • 5-10年
    59.4% of total 59.4%
  • 3-5年
    23.6% of total 23.6%
  • 不限
    16% of total 16%
  • 1-3年
    0.9% of total 0.9%
View Detailed Analysis

What does 芯合半导体(合肥)有限公司 require? Who is 芯合半导体(合肥)有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占39.6%,其次是计算机/网络/技术类占19.8%. What education can get in at ? 本科占比最多占81.1%,其次是大专占12.3%. High education required at ? 硕士占3.8%. Work experience required at ? 5-10年占比最多占59.4%,其次是3-5年占23.6%. Where are the job locations at ? 合肥占比最多占50.9%,其次是北京占32.1%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 16,679.0706万(元)
Legal Representative: 洪伟刚
Date Established:
Credit Code: 91340123MA8QKJEQ8G
Registered Address: 安徽省合肥市高新区城西桥社区服务中心望江西路920号中安创谷科技园二期F8栋20层A19-3

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