Company Overview

Development Stage

About the Company

Hefei Tongfu Microelectronics Co., Ltd. is located at No. 578 Weixing Road, Economic and Technological Development Zone, Hefei City. It specializes in integrated circuit packaging and testing services. The company is jointly invested by Nantong Tongfu Microelectronics Co., Ltd., Hefei Haiheng Investment Holding Group Corporation, and Hefei Industrial Investment Guidance Fund Co., Ltd., and is operated by Nantong Tongfu Microelectronics Co., Ltd. Nantong Tongfu Microelectronics Co., Ltd. was established in 1994, headquartered in Nantong City, Jiangsu Province. It is one of the top three IC packaging and testing enterprises in China, and more than half of the world's top ten semiconductor manufacturers are customers of Nantong Tongfu Microelectronics. The company's packaging technologies include advanced packaging and testing technologies such as Bumping, WLCSP, FC, BGA, and SiP, as well as traditional packaging technologies like QFN, QFP, and SO, along with packaging technologies for automotive electronics products and MEMS. Nantong Tongfu Microelectronics Co., Ltd. is the first among domestic packaging and testing enterprises in China to achieve full-process large-scale production of 12-inch 28nm mobile phone processor chips in the back-end process, including Bumping, CP, FC, FT, and SLT. Hefei Tongfu Microelectronics Co., Ltd. covers an area of approximately 198 mu, with a building area of 180,000 square meters, including a production plant area of 94,000 square meters, and will have over 50,000 square meters of modern factories, equipped with central air conditioning to keep warm in winter and cool in summer. The company is planned to be built into a green benchmark factory with the most complete process technology, the highest technical level, the most advanced automation, first-class environmental protection, and first-class energy conservation by early 2016. Hefei Tongfu Microelectronics Co., Ltd. is adjacent to Hefei Export Processing Zone, with an advantageous geographical location and convenient cultural, transportation, and communication facilities. The company strictly protects employees' labor rights, cares about their career development, conducts targeted training activities, sets up career promotion channels, and provides a platform for employees to demonstrate their abilities. The company cares about employees' lives, with complete living and entertainment facilities and rich cultural and sports activities.

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (36 open positions)

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Note: How fast is hiring at Hefei Tongfu Microelectronics Co., Ltd. growing? 2026: 84 openings (up 110%), 2025: 40 openings (down 27%), 2024: 55 openings (up 12%), 2023: 49 openings (down 42%), 2022: 84 openings (up 9%), 2021: 77 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at Hefei Tongfu Microelectronics Co., Ltd.? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 24.2%, "生物/制药/化工/环保类": 12.1%, "机械/仪器仪表类": 6.1%, "其他(研发和技术类)": 1%, "美术/设计/创意类": 1%. For reference only.

— What Are the Salaries Like? (99 records)

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salary range: 4.5K - 20K, 89.9% of roles pay ¥6-10K
Note: salary statistics are based on 99 salary records from the past year and depend on the job sample. For reference only.
How is the salary at Hefei Tongfu Microelectronics Co., Ltd.?89.9% of positions earn 6-10K, Undergraduate salary: ¥。技工类 average salary ¥7.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at Hefei Tongfu Microelectronics Co., Ltd.? We provide: 质检,普工,操作工,车间,设备工,工艺工程,流水线,设备技术,操作员,生产人员,生产计划,pe,产品设计,人事,制程工程师,夜班,安检,工人,工艺高级工程师,手工. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Related Industry Tags

Job Category

  • 技工类
    71% of total 71%
  • 质量管理类
    30% of total 30%
  • 电子/电器/通信技术类
    24% of total 24%
  • 工厂生产类
    14% of total 14%

Education

  • 不限
    72% of total 72%
  • 大专
    20% of total 20%
  • 本科
    6% of total 6%
  • 高中
    2% of total 2%

Experience

  • 不限
    89% of total 89%
  • 1-3年
    5% of total 5%
  • 3-5年
    3% of total 3%
  • 5-10年
    3% of total 3%
View Detailed Analysis

What does Hefei Tongfu Microelectronics Co., Ltd. require? Who is Hefei Tongfu Microelectronics Co., Ltd. hiring? recruitment: 技工类占比最多占71%,其次是质量管理类占30%. What education can get in at ? 不限占比最多占72%,其次是大专占20%. Work experience required at ? 不限占比最多占89%,其次是1-3年占5%. Where are the job locations at ? 合肥占比最多占99%,其次是南京占1%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 250,000万(元)
Legal Representative: 石磊
Date Established:
Credit Code: 9134010032803903XA
Registered Address: 安徽省合肥市经济技术开发区卫星路578号

Partners & Suppliers

AMD为合肥通富微电子有限公司的主要客户,提供封装测试服务 Source
合作客户 芯片设计
合肥通富采购三井化学的塑封料 Source
供应商 半导体材料
合肥通富采购库力索法的封装设备 Source
供应商 半导体设备
合肥通富采购应用材料的封装设备 Source
供应商 半导体设备
合肥通富为紫光展锐提供芯片封装测试服务 Source
合作客户 芯片设计

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