Hefei Tongfu Microelectronics Co., Ltd. is located at No. 578 Weixing Road, Economic and Technological Development Zone, Hefei City. It specializes in integrated circuit packaging and testing services. The company is jointly invested by Nantong Tongfu Microelectronics Co., Ltd., Hefei Haiheng Investment Holding Group Corporation, and Hefei Industrial Investment Guidance Fund Co., Ltd., and is operated by Nantong Tongfu Microelectronics Co., Ltd. Nantong Tongfu Microelectronics Co., Ltd. was established in 1994, headquartered in Nantong City, Jiangsu Province. It is one of the top three IC packaging and testing enterprises in China, and more than half of the world's top ten semiconductor manufacturers are customers of Nantong Tongfu Microelectronics. The company's packaging technologies include advanced packaging and testing technologies such as Bumping, WLCSP, FC, BGA, and SiP, as well as traditional packaging technologies like QFN, QFP, and SO, along with packaging technologies for automotive electronics products and MEMS. Nantong Tongfu Microelectronics Co., Ltd. is the first among domestic packaging and testing enterprises in China to achieve full-process large-scale production of 12-inch 28nm mobile phone processor chips in the back-end process, including Bumping, CP, FC, FT, and SLT. Hefei Tongfu Microelectronics Co., Ltd. covers an area of approximately 198 mu, with a building area of 180,000 square meters, including a production plant area of 94,000 square meters, and will have over 50,000 square meters of modern factories, equipped with central air conditioning to keep warm in winter and cool in summer. The company is planned to be built into a green benchmark factory with the most complete process technology, the highest technical level, the most advanced automation, first-class environmental protection, and first-class energy conservation by early 2016. Hefei Tongfu Microelectronics Co., Ltd. is adjacent to Hefei Export Processing Zone, with an advantageous geographical location and convenient cultural, transportation, and communication facilities. The company strictly protects employees' labor rights, cares about their career development, conducts targeted training activities, sets up career promotion channels, and provides a platform for employees to demonstrate their abilities. The company cares about employees' lives, with complete living and entertainment facilities and rich cultural and sports activities.
What does Hefei Tongfu Microelectronics Co., Ltd. require? Who is Hefei Tongfu Microelectronics Co., Ltd. hiring? recruitment: 技工类占比最多占71%,其次是质量管理类占30%. What education can get in at ? 不限占比最多占72%,其次是大专占20%. Work experience required at ? 不限占比最多占89%,其次是1-3年占5%. Where are the job locations at ? 合肥占比最多占99%,其次是南京占1%. Based on job postings from the past year, for reference only.
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