HIT

The Center for Innovation in Extreme Environment Materials and Devices at Harbin Institute of Technology focuses on the demands for high-end electronic devices and materials, integrating research and development, production, sales, and service as a comprehensive high-tech institution. Over the years, it has been engaged in R&D in fields such as EDA software development, electronic component design, and high-end semiconductor packaging materials, and has established an open research platform with internationally advanced and leading-level capabilities. It possesses extensive experience in aerospace-grade electronic device design, reliability evaluation, EDA software development, and high-end semiconductor packaging materials, fully mastering key technologies in process and device simulation tool research and development. The institution has established an advanced electronic device and materials R&D base, equipped with independently owned intellectual property simulation software, electronic materials production platforms, device R&D platforms, and packaging, testing, and evaluation platforms. The institution focuses on providing customers with comprehensive solutions for high-end electronic devices and materials, possessing R&D and pilot-scale capabilities for four major electronic material products: silver paste materials, potting materials, protective materials, and molding compounds. It has formed long-term stable strategic cooperative relationships with major domestic users. We sincerely invite talents from all walks of life to join us and create great achievements together!