Xingsen Technology funding history / development milestones

IPO上市,主板

2010.06.18,深交所

Note: collected from public online reports, for reference only.

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Xingsen Technology Competitors (Similar Companies)

“Manufacturer of prototype printed circuit boards and quick-turn sample”
“Focusing on the electronic interconnection field, with three businesse”
光纤 光通信器件 光传输 光无源器件
半导体 半导体分立器件 芯片 分立器件
数控/CNC 电镀镍 通讯设备 生产
“Research, development, production and sales of printed circuit boards”
遥控器 线材 生产 研发
“Rooted in China, innovating together; with a grand vision, developing ”
液位仪 液位仪表 先进制造 自动化仪表
“Electronic components and advanced technical ceramics industrial base”
“把华天打造成为世界知名的半导体封装测试企业”
电子商务 网络科技 B2B B2C
EMS 通信设备 ODM 移动通信设备
“Leading automotive electronics enterprise, smart mobility solutions”
“It is a core global supplier of electronic circuit substrates, integra”