Shenghua Microelectronics

Changsha Shenghua Microelectronics Materials Co., Ltd. was founded in 2000. Its original site was located on the campus of Central South University in Changsha, Hunan, and in May 2013 it moved to the Jinzhou New District Industrial Park in Ningxiang, Hunan. It is a high-tech enterprise in Hunan Province, specializing in the production of high-performance electronic packaging materials such as tungsten-copper, molybdenum-copper, copper/molybdenum/copper, and copper/Mo70Cu/copper. Relying on advanced material preparation technology, complete material testing equipment, and modern scientific management systems, and supported by the strong technological development strength of Central South University, the company is in a leading position in the field of electronic packaging materials, and its technological achievements are at the international advanced level. Its products have successively won the Second Prize of Science and Technology Progress Award and the Second Prize of Hunan Provincial Science and Technology Progress Award, and it has received key funding from the Small and Medium-sized Enterprise Innovation Fund and has been rated as a National Key New Product.
The company mainly produces the following four types of new electronic packaging materials: 1. W-Cu series, specific grades: W-10Cu, W-15Cu, W-20Cu, etc.; 2. Mo-Cu series, specific grades: Mo70-Cu, Mo60-Cu, Mo50-Cu, etc.; 3. Cu/Mo/Cu series: thickness ratios can range from 1:1:1 to 13:74:13, etc.; 4. Cu/Mo70Cu/Cu series: thickness ratio 1:4:1 and others.
The products have been widely used in microwave devices, laser power housings, communications, and other fields, meeting the needs of China's aerospace, power electronics, optical communications, and other industries. In addition, they are also exported to the United States, South Korea, Singapore, Taiwan, and other countries and regions.