华天科技 funding history / development milestones

IPO上市，主板

2007.11.20，深交所

Note: collected from public online reports, for reference only.

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微电子

芯片

集成电路/IC

BGA

工业控制

芯片封装

集成电路封装测试

集成电路封装

半导体

半导体封装测试

半导体封装

半导体测试

半导体照明

电子封装

封装

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驱动芯片半导体集成电路/IC 显示驱动

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