Company Overview

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About the Company

[Summary] 0.15微米6吋第二代/第三代半导体集成电路制造

成都海威华芯科技有限公司位于成都市双流县物联网产业园区,是国内率先提供六英吋砷化镓/氮化镓微波集成电路(GaAs/GaN MMIC)的晶圆代工(Foundry)服务公司。海威华芯拥有完整的技术团队、先进的GaAs/GaN集成电路制造技术和生产设备,其“六英吋GaAs/GaN集成电路Foundry线”填补了国内空白,达到国际先进水平。
公司提供的产品与服务主要包括:
1、砷化镓/氮化镓微波集成电路(GaAs/GaN MMIC)的晶圆代工(Foundry)服务;
2、砷化镓/氮化镓等化合物半导体光电产品;
3、与砷化镓/氮化镓相关无源产品;

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海威华芯 Financing History (1 rounds)

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战略投资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 12.88亿人民币
  • Investor: 正威金控

海威华芯 How Fast Is Hiring Growing? (48 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 633%
  • 2024: Down 76%
  • 2023: Down 30%
  • 2022: Up 6%
海威华芯 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
海威华芯 Campus Recruitment & Advanced Degree Talent Demand
Master's 3 Doctorate 5
Note: How fast is hiring at 成都海威华芯科技有限公司 growing? 海威华芯2025: 66 openings (up 633%), 2024: 9 openings (down 76%), 2023: 38 openings (down 30%), 2022: 54 openings (up 6%), 2021: 51 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

海威华芯 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Flat 0%-
  • 2024: Down 80%
  • 2023: Up 25%
  • 2022: Down 50%
海威华芯 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 成都海威华芯科技有限公司 growing? 海威华芯Master's recruitment over the years: 2025: 1 openings (flat), 2024: 1 openings (down 80%), 2023: 5 openings (up 25%), 2022: 4 openings (down 50%), 2021: 8 openings.

海威华芯 Doctoral Degree Job Demand Analysis

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+500%
Growth Rate
2026 vs 2025
海威华芯 Doctoral Hiring by Year: 2026 — 5 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 成都海威华芯科技有限公司 growing? 海威华芯Doctorate recruitment over the years: 2026: 6 openings (up 200%), 2025: 1 openings (flat).

海威华芯 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 成都海威华芯科技有限公司? Based on an analysis of 海威华芯's job postings over the past year, "电子/电器/通信技术类" demand: 16.5%, "其他(研发和技术类)": 11.8%, "计算机/网络/技术类": 10.6%, "机械/仪器仪表类": 5.9%, "科研类": 3.5%, "电气/能源/动力类": 2.4%. For reference only.

海威华芯 — What Are the Salaries Like? (85 records)

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海威华芯 Salary Overview
salary range: 4.5K - 50K, 48.2% of roles pay ¥15-50K
Note: salary statistics are based on 85 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 成都海威华芯科技有限公司?海威华芯48.2% of positions earn 15-50K, Undergraduate salary: ¥。Chengdu salary ranking: #620,经营管理类 average salary ¥28.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 海威华芯

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Are salaries high at 成都海威华芯科技有限公司? We provide: 人力,工艺研发,测试工程,设备工,部长,工艺工程,人事,分析,副总,助理工程,射频测试,整合工程师,法务,财务,资源主管,运维,会计,保密专员,写作,培训. Click to view detailed salary analysis by job.

海威华芯 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

海威华芯 Related Industry Tags

Job Category

  • 经营管理类
    24.7% of total 24.7%
  • 技工类
    20% of total 20%
  • 电子/电器/通信技术类
    16.5% of total 16.5%
  • 质量管理类
    15.3% of total 15.3%

Education

  • 本科
    75.3% of total 75.3%
  • 大专
    8.2% of total 8.2%
  • 博士
    8.2% of total 8.2%
  • 硕士
    3.5% of total 3.5%

Experience

  • 不限
    30.6% of total 30.6%
  • 1-3年
    24.7% of total 24.7%
  • 5-10年
    23.5% of total 23.5%
  • 3-5年
    21.2% of total 21.2%
View Detailed Analysis

What does 成都海威华芯科技有限公司 require? Who is 海威华芯 hiring? 海威华芯 recruitment: 经营管理类占比最多占24.7%,其次是技工类占20%. What education can get in at 海威华芯? 本科占比最多占75.3%,其次是大专占8.2%. High education required at 海威华芯? 博士占8.2%,硕士占3.5%. Work experience required at 海威华芯? 不限占比最多占30.6%,其次是1-3年占24.7%. Where are the job locations at 海威华芯? 成都占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 195,778.86万(元)
Legal Representative: 马晓力
Date Established:
Credit Code: 915101225644859044
Registered Address: 中国(四川)自由贸易试验区成都市双流区西南航空港经济开发区物联大道88号

Partners & Suppliers

向海威华芯供应高纯氮气等电子气体,用于化合物半导体芯片制造 Source
供应商 半导体
海威华芯为29所提供军用化合物半导体芯片代工服务 Source
合作客户 芯片代工/化合物半导体
海威华芯与电子科技大学共建化合物半导体联合实验室及人才培养合作 Source
供应商 高校/研究院合作

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