纳芯微 funding history / development milestones

IPO上市,

2022.04.22,上交所

IPO上市,

2022.04.01,

股权融资,融资金额未公开

Pre-IPO,

2020.06.01,

B轮,数千万人民币

2019.10.14, 中芯聚源, 千乘资本

B轮,数千万人民币

2019.10.01, 千乘资本, 中芯聚源

Note: collected from public online reports, for reference only.

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半导体 芯片封装 半导体制造 图形处理器/GPU
“功率及数模混合芯片设计”
“Committed to providing the industry with high-performance, high-qualit”
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“Development and manufacturing of semiconductor materials, devices, and”
“重塑全屋生态,打开未来智慧生活”
“高功率密度高效率电源芯片研发”
“我们一起创造We make it together ”
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半导体 光源 芯片 集成电路/IC
“IC chip design”
“Empowering the information society with storage technology, improving ”
“高性能模拟和数模混合半导体供应商”