Unigroup Tongxin Microelectronics Co., Ltd. R&D strength - Jobui

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Unigroup Tongxin R&D strength (tech talent demand and pay)

What is the demand for tech talent at Unigroup Tongxin? Based on job postings in the past year, “计算机/网络/技术类”占43.9%，“电子/电器/通信技术类”占26.1%，“其他（研发和技术类）”占15%，“生物/制药/化工/环保类”占8.9%，“机械/仪器仪表类”占0.6%. For reference only.

计算机/网络/技术类 salary: 93.7% of positions pay ¥20-50K以上/month

2.5% 10-15K 3.8% 15-20K 15.2% 20-30K 8.9% 30-50K 69.6% 50K以上

计算机/网络/技术类 talent demand: 79 positions, 43.9%, hot jobs:

Master's degree job demand analysis at Unigroup Tongxin (More)

2025: Down 47%
2024: Down 17%
2023: Up 24%
2022: Up 175%

Unigroup Tongxin master's hiring over the years:

2021 12 positions 2022 33 positions 2023 41 positions 2024 34 positions 2025 18 positions 2026 ? *** 

* Hiring volume was generally low in 2020-2022 due to the pandemic

Master's salary 򀀩

PhD job demand analysis at Unigroup Tongxin (More)

N/A

Growth rate

Unigroup Tongxin PhD hiring over the years:

2023 1 positions 2024 1 positions 2025 1 positions

* Hiring volume was generally low in 2020-2022 due to the pandemic

PhD salary 򀀩

Unigroup Tongxin honors, qualifications & industry associations

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Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Talent Demand Trend Analysis More

集成电路设计

芯片

集成电路/IC

半导体

CPU

智能POS

信息安全芯片

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