Unigroup Tongxin

Unigroup Tongxin Microelectronics Co., Ltd. (referred to as "Unigroup Tongxin") is a core enterprise of the automotive electronics and intelligent chip sector of New Unigroup Group. It was established in 2001 by the national second-generation resident ID card chip R&D team from the Microelectronics Institute of Tsinghua University, transplanted with its technology. The company has undertaken multiple major national industrialization projects, including second-generation ID card chips, chips for electronic tickets at the 2008 Olympic Games, high-capacity high-security dual-interface financial chips, and automotive domain control MCU chips. Focusing on automotive electronics and security chip fields, it has cumulatively shipped over 27 billion units, providing products and services to more than 20 countries and regions across Asia, Europe, America, and Africa.
After 24 years of continuous innovation and breakthroughs, Unigroup Tongxin has accumulated industry-leading chip R&D technology and wafer testing capabilities. It has won multiple authoritative awards and certifications, including the National Science and Technology Progress First Prize, CC EAL6+, GSMA SAS-UP, AEC-Q100 Grade1, and ISO 26262 ASIL D, and has developed into an industry-leading chip and solution provider.