HuaYi Microelectronics Co., Ltd. R&D strength - Jobui

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HuaYi Microelectronics R&D strength (tech talent demand and pay)

What is the demand for tech talent at HuaYi Microelectronics? Based on job postings in the past year, “电子/电器/通信技术类”占30.9%，“其他（研发和技术类）”占12.2%，“计算机/网络/技术类”占10.6%，“机械/仪器仪表类”占3.7%，“美术/设计/创意类”占3.2%，“生物/制药/化工/环保类”占2.7%，“电气/能源/动力类”占1.1%，“医疗卫生/美容保健类”占0.5%. For reference only.

电子/电器/通信技术类 salary: 72.4% of positions pay ¥6-10K/month

8.6% 4.5-6K 58.6% 6-8K 13.8% 8-10K 12.1% 10-15K 3.4% 20-30K 3.4% 30-50K

电子/电器/通信技术类 talent demand: 58 positions, 30.9%, hot jobs:

Master's degree job demand analysis at HuaYi Microelectronics (More)

Flat

Growth rate

2026 vs 2025

HuaYi Microelectronics master's hiring over the years: 2026: on par with 2025

2021 1 positions 2022 1 positions 2023 1 positions 2025 1 positions 2026 1 positions

* Hiring volume was generally low in 2020-2022 due to the pandemic

Master's salary 򀀩

PhD job demand analysis at HuaYi Microelectronics (More)

N/A

Growth rate

HuaYi Microelectronics PhD hiring over the years:

2021 1 positions 2023 1 positions 2024 3 positions

* Hiring volume was generally low in 2020-2022 due to the pandemic

PhD salary 򀀩

HuaYi Microelectronics honors, qualifications & industry associations

More

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Talent Demand Trend Analysis More

微电子

半导体封装

压力传感器

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混合集成电路

半导体封装设备

半导体

传感器

功率半导体

变送器

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