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About the Company

山东才聚电子科技公司是一家专门从事研发、生产功率器件封装设备的高新技术企业,拥有多年非标设备设计制造经验,是一家靠自主知识产权成长起来的研发型企业。公司拥有先进的自动化加工设备和完善的设计、研发、组装、编程全流程的生产体系,可供应专业的集成电路后道封装设备,能满足SMD、TO、SOP、DIP、SOT、LQFP、IGBT、MOS、光伏器件等形式的封装技术和工艺要求。公司主要生产设备有:在线真空焊接炉、自动厚网膜网印机、芯片测试分选机、组焊线、自动CLIP切筋装配机、粘胶机、测试机、桥式一贯机、焊接炉 、自动点胶机、合片机。

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Operating Status: 开业
Registered Capital: 3,000万(元)
Legal Representative: 李向东
Date Established:
Credit Code: 91370303776316053U
Registered Address: 山东省淄博市周村区北郊镇创新产业园4号楼A区

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