Hwatsing Technology Joint-stock Co., Ltd. R&D strength

Hwatsing R&D strength (tech talent demand and pay)

What is the demand for tech talent at Hwatsing? Based on job postings in the past year, “电子/电器/通信技术类”占44.8%，“机械/仪器仪表类”占41.6%，“其他（研发和技术类）”占11.2%，“电气/能源/动力类”占10.4%，“计算机/网络/技术类”占9.6%，“生物/制药/化工/环保类”占2.4%，“科研类”占0.8%. For reference only.

电子/电器/通信技术类 salary: 80.3% of positions pay ¥8-15K/month

3.6% 4.5-6K 5.4% 6-8K 46.4% 8-10K 33.9% 10-15K 7.1% 15-20K 3.6% 30-50K

电子/电器/通信技术类 talent demand: 56 positions, 44.8%, hot jobs:

Master's degree job demand analysis at Hwatsing (More)

Growth rate

2026 vs 2025

2025: Up 42%
2024: Down 10%
2023: Down 19%
2022: Up 333%

Hwatsing master's hiring over the years:

2021 6 positions 2022 26 positions 2023 21 positions 2024 19 positions 2025 27 positions 2026 ? *** 

* Hiring volume was generally low in 2020-2022 due to the pandemic

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Master's salary 򀀩

PhD job demand analysis at Hwatsing (More)

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Growth rate

Hwatsing PhD hiring over the years:

2021 4 positions 2022 1 positions 2023 1 positions 2024 2 positions 2025 1 positions

* Hiring volume was generally low in 2020-2022 due to the pandemic

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PhD salary 򀀩

Hwatsing honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Talent Demand Trend Analysis More

CMP设备

集成电路制造

晶圆厂/晶圆

半导体

半导体设备

第三代半导体

硅片

减薄机

国产化

半导体硅晶片

机电设备

电子元件

表面处理

机械工程

机电系统

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