Times Speedcom

Shenzhen Times Speedcom Technology Co., Ltd. (hereinafter referred to as "Times Speedcom") was founded in 2017 and is headquartered in Shenzhen. It is one of the few leading enterprises in China engaged in RF and microwave chip R&D and module production, integrating first-generation Si RF, second-generation GaAs, and third-generation GaN processes. The company has established subsidiaries and R&D centers in Beijing, Shanghai, Chengdu, Wuxi, Xi'an, Nanjing, and other locations. Among them, it has a 12,000-square-meter advanced packaging production line in Wuxi and a 6,000-square-meter high-integration module production and R&D base in Chengdu, with capabilities for mass production, testing, and reliability experiments of chips and modules.
The company has been recognized as a National Specialized, Refined, Distinctive, and Innovative Key "Little Giant" Enterprise and a National High-Tech Enterprise. It has passed multiple authoritative certifications including ISO9001 Quality Management System, ISO14001 Environmental Management System, Intellectual Property Compliance Management System, IATF 16949 Quality Management System, and CNAS. It is an RF chip enterprise that has obtained automotive-grade AEC-Q100 certification. The company has received multiple rounds of investment from several well-known institutions and possesses strong capital strength.
The company currently has over 300 employees, with the R&D team accounting for more than 50%. The team brings together senior experts from well-known domestic and international enterprises such as Qorvo, NXP, Infineon, and CR Micro, as well as chip R&D experts who graduated from renowned institutions including Peking University, Fudan University, Huazhong University of Science and Technology, Southeast University, University of Electronic Science and Technology of China, Xidian University, University of Science and Technology of China, and Delft University of Technology, with over 10 years of industry experience.
Since its establishment, the company has completed the R&D of more than 2,000 chips. Its products are widely used in core fields such as commercial aerospace, automotive electronics, industrial manufacturing, and communications. Many of these chips have broken foreign technological monopolies, achieved import substitution, been mass-supplied for national key projects, and are stably supplied to well-known enterprises such as China SatNet, COMAC, BYD, Xiaomi, BAIC, ZTE, and Jingxin Communications, empowering the high-quality development of China's high-end electronics industry with independently developed hardcore "China Chips."