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Company Overview

Development Stage

About the Company

承芯半导体成立于2019年9月,2020年4月正式运营。由武岳峰资本联合寰宇通讯、晶品光电投资成立,注册资本6.5亿元人民币。公司位于江苏常州武进高新区,主要为化合物半导体(砷化镓、氮化镓)第二、第三代晶圆制造及超级代工服务,并在上海成立了研发工程中心及销售办公室,目前员工人数750人。
承芯半导体的发展战略为引进寰宇通讯的技术,在*短时间建立团队,达到HBT, pHEMT, VCSEL, 滤波器量产目标,同时与西电合作开发第三代半导体技术,持续优化5G所需的化合物半导体制程,希冀于5年内可以达到后摩尔时代创领者的愿景

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承芯半导体 Financing History (5 rounds)

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B轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 武进高新投,江苏国经资本

承芯半导体 How Fast Is Hiring Growing? (46 open positions)

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Note: How fast is hiring at 常州承芯半导体有限公司 growing? 承芯半导体2025年99个(增长106%),2024年48个(下降27%),2023年66个(下降24%),2022年87个(增长2%),2021年85个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

承芯半导体 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Up 67%
  • 2024: Down 40%
  • 2023: Flat 0%-
承芯半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 常州承芯半导体有限公司 growing? 承芯半导体历年硕士招聘职位量:2025年5个(增长67%),2024年3个(下降40%),2023年5个(持平),2022年5个. 承芯半导体在常州硕士人才需求中排名第32, 承芯半导体硕士工资大部分在8-30K.

承芯半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 常州承芯半导体有限公司? Based on an analysis of 承芯半导体's job postings over the past year, “电子/电器/通信技术类”需求占24.1%,“生物/制药/化工/环保类”占22.8%,“机械/仪器仪表类”占21.5%,“其他(研发和技术类)”占15.2%,“美术/设计/创意类”占1.3%. For reference only.

承芯半导体 — What Are the Salaries Like? (79 records)

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承芯半导体 Salary Overview
salary range: 4.5K - 50K, 58.2% of roles pay ¥10-20K
Note: salary statistics are based on 79 salary records from the past year and depend on the job sample. For reference only.
常州承芯半导体有限公司工资待遇怎么样?承芯半导体58.2%的岗位拿10-20K,应届生工资¥。常州地区工资排名第266,与同行业比+5%,技工类平均工资¥14.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 承芯半导体

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Are salaries high at 常州承芯半导体有限公司? We provide: 设备工,工艺工程,质量,设计工程师,作业员,整合工程师,管理工程师,fa,分析,半导体技术,客户服务,工艺倒班工程师,技术工程师,服务专员,研发工程师,管理师,课长,dcc,pv,qe. Click to view detailed salary analysis by job.

Job Category

  • 技工类
    36.4% of total 36.4%
  • 工厂生产类
    25.2% of total 25.2%
  • 电子/电器/通信技术类
    25.2% of total 25.2%
  • 机械/仪器仪表类
    21.5% of total 21.5%

Education

  • 本科
    57.9% of total 57.9%
  • 不限
    23.4% of total 23.4%
  • 大专
    8.4% of total 8.4%
  • 硕士
    6.5% of total 6.5%

Experience

  • 1-3年
    32.7% of total 32.7%
  • 不限
    22.4% of total 22.4%
  • 3-5年
    21.5% of total 21.5%
  • 应届生
    13.1% of total 13.1%
View Detailed Analysis

What does 常州承芯半导体有限公司 require? Who is 承芯半导体 hiring? 承芯半导体招聘类别技工类占比最多占36.4%,其次是工厂生产类占25.2%。承芯半导体什么学历能进?本科占比最多占57.9%,其次是不限占23.4%。承芯半导体学历要求高吗?硕士占6.5%,博士占0.9%。工作经验承芯半导体有什么要求?1-3年占比最多占32.7%,其次是不限占22.4%。承芯半导体工作地区在哪?常州占比最多占92.5%,其次是上海占5.6%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 70,228.4097万(元)
Legal Representative: 余楚荣
Date Established:
Credit Code: 91320412MA205HM12G
Registered Address: 武进国家高新技术产业开发区淹城南路520号

Partners & Suppliers

承芯半导体向荣耀供应射频前端模组。 Source
合作客户 智能手机
承芯半导体向小米供应射频前端模组。 Source
合作客户 智能手机
Qorvo向承芯半导体授权BAW滤波器技术。 Source
供应商 技术授权
环旭电子为承芯半导体提供系统级封装(SiP)服务。 Source
供应商 芯片封测
中芯国际为承芯半导体提供射频前端芯片的晶圆代工服务。 Source
供应商 芯片代工

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“致力于开发传感器”

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