Company Overview

Development Stage

About the Company

常州承芯半导体有限公司是外商投资、非独资企业,成立于2019年9月27日,由常州仟朗实业、江苏芯卓投资有限公司、GCS Holdings, Inc、晶品光电(常州)有限公司, 共同合伙投资,承芯半导体注册资本65286.0897万元,公司的注册经营范围为: 货物进出口,技术进出口(依法须经批准的项目),半导体分立器件制造;半导体分立器件销售;集成电路芯片及产品制造;集成电路芯片及产品销售;集成电路制造;集成电路销售;集成电路芯片设计及服务;光电子器件制造;光电子器件销售。

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承芯半导体 Financing History (5 rounds)

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B轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 武进高新投,江苏国经资本

承芯半导体 How Fast Is Hiring Growing? (23 open positions)

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Note: How fast is hiring at 常州承芯半导体有限公司 growing? 承芯半导体2026: 88 openings (down 11%), 2025: 99 openings (up 106%), 2024: 48 openings (down 27%), 2023: 66 openings (down 24%), 2022: 87 openings (up 2%), 2021: 85 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

承芯半导体 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 67%
  • 2024: Down 40%
  • 2023: Flat 0%-
承芯半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 常州承芯半导体有限公司 growing? 承芯半导体Master's recruitment over the years: 2025: 5 openings (up 67%), 2024: 3 openings (down 40%), 2023: 5 openings (flat), 2022: 5 openings.

承芯半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 常州承芯半导体有限公司? Based on an analysis of 承芯半导体's job postings over the past year, "电子/电器/通信技术类" demand: 25.6%, "生物/制药/化工/环保类": 20.7%, "机械/仪器仪表类": 19.5%, "其他(研发和技术类)": 14.6%, "美术/设计/创意类": 1.2%. For reference only.

承芯半导体 — What Are the Salaries Like? (82 records)

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salary range: 6K - 50K, 58.5% of roles pay ¥10-20K
Note: salary statistics are based on 82 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 常州承芯半导体有限公司?承芯半导体58.5% of positions earn 10-20K, Fresh graduate salary: ¥9.0K。Changzhou salary ranking top 45,技工类 average salary ¥16.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 承芯半导体

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Are salaries high at 常州承芯半导体有限公司? We provide: 设备工,工艺工程,质量,设计工程师,作业员,管理工程师,fa,仓库,分析,半导体技术,客户服务,工艺倒班工程师,库管,技术工程师,整合工程师,服务专员,研发工程师,管理师,课长,dcc. Click to view detailed salary analysis by job.

承芯半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 技工类
    34.5% of total 34.5%
  • 工厂生产类
    29.1% of total 29.1%
  • 电子/电器/通信技术类
    26.4% of total 26.4%
  • 机械/仪器仪表类
    20% of total 20%

Education

  • 本科
    57.3% of total 57.3%
  • 不限
    21.8% of total 21.8%
  • 大专
    10.9% of total 10.9%
  • 硕士
    6.4% of total 6.4%

Experience

  • 1-3年
    31.8% of total 31.8%
  • 不限
    21.8% of total 21.8%
  • 3-5年
    20% of total 20%
  • 应届生
    13.6% of total 13.6%
View Detailed Analysis

What does 常州承芯半导体有限公司 require? Who is 承芯半导体 hiring? 承芯半导体 recruitment: 技工类占比最多占34.5%,其次是工厂生产类占29.1%. What education can get in at 承芯半导体? 本科占比最多占57.3%,其次是不限占21.8%. High education required at 承芯半导体? 硕士占6.4%,博士占0.9%. Work experience required at 承芯半导体? 1-3年占比最多占31.8%,其次是不限占21.8%. Where are the job locations at 承芯半导体? 常州占比最多占92.7%,其次是上海占5.5%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 70,228.4097万(元)
Legal Representative: 余楚荣
Date Established:
Credit Code: 91320412MA205HM12G
Registered Address: 武进国家高新技术产业开发区淹城南路520号

Partners & Suppliers

承芯半导体向荣耀供应射频前端模组。 Source
合作客户 智能手机
承芯半导体向小米供应射频前端模组。 Source
合作客户 智能手机
Qorvo向承芯半导体授权BAW滤波器技术。 Source
供应商 技术授权
环旭电子为承芯半导体提供系统级封装(SiP)服务。 Source
供应商 芯片封测
中芯国际为承芯半导体提供射频前端芯片的晶圆代工服务。 Source
供应商 芯片代工

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承芯半导体 Competitors (Similar Companies)

摄像头 精密制造 振动马达 仪器/仪表
半导体 芯片制造 OLED 芯片设计
“电力电子器件及系统解决方案”
“追求卓越品质,永远满足顾客”
“专业从事半导体器件研发、生产、销售和服务”
“德国封装电路板制造商在华子公司”
光电 触摸屏 TFT-LCD 多晶硅
太阳能 电池 风能 储能
“高功率以及高频率VCSEL解决方案”
“专业从事半导体分立器件、电力电子元器件研发、制造和销售 ”
电子设备 电子厂/电子 转换器 电源转换
“Providing first-class solutions for global new energy applications”
半导体 芯片封装 半导体制造 图形处理器/GPU
晶圆代工 半导体 积体电路制造 生产

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