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Company Overview

Development Stage

About the Company

上海芯谦集成电路有限公司(简称“芯谦”)是一家在上海的CMP耗材生产研发公司,致力于做*的CMP抛光垫生产技术,生产集成电路各节点所需的各种晶圆制造抛光垫,用于集成电路晶圆的纳米级抛光。公司主营大硅片抛光,蓝宝石抛光,金属LOGO抛光等相关抛光业务。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (13 open positions)

Manage
?
Growth Rate
2026 vs 2025
  • 2025: Down 27%
  • 2024: Up 100%
  • 2023: Down 21%
  • 2022: Up 8%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Campus Recruitment & Advanced Degree Talent Demand
Master's 1
Note: How fast is hiring at 上海芯谦集成电路有限公司 growing? 2025年16个(下降27%),2024年22个(增长100%),2023年11个(下降21%),2022年14个(增长8%),2021年13个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

(More)
-50%
Growth Rate
2026 vs 2025
  • 2025: Flat 0%-
  • 2024: Up 100%
Master's Hiring by Year: 2026 — 1 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 上海芯谦集成电路有限公司 growing? 历年硕士招聘职位量:2026年1个(下降50%),2025年2个(持平),2024年2个(增长100%),2023年1个.

— What Are the Salaries Like? (19 records)

Manage
salary range: 3K - 50K, 63.1% of roles pay ¥15-50K
Note: salary statistics are based on 19 salary records from the past year and depend on the job sample. For reference only.
上海芯谦集成电路有限公司工资待遇怎么样?63.1%的岗位拿15-50K,本科工资¥。与同行业比-12%,其他(研发和技术类)平均工资¥25.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 其他(研发和技术类)
    26.3% of total 26.3%
  • 技工类
    26.3% of total 26.3%
  • 工厂生产类
    15.8% of total 15.8%
  • 机械/仪器仪表类
    15.8% of total 15.8%

Education

  • 本科
    47.4% of total 47.4%
  • 高中
    21.1% of total 21.1%
  • 大专
    15.8% of total 15.8%
  • 硕士
    15.8% of total 15.8%

Experience

  • 不限
    68.4% of total 68.4%
  • 3-5年
    21.1% of total 21.1%
  • 1-3年
    10.5% of total 10.5%
View Detailed Analysis

What does 上海芯谦集成电路有限公司 require? Who is 上海芯谦集成电路有限公司 hiring? 招聘类别其他(研发和技术类)占比最多占26.3%,其次是技工类占26.3%。什么学历能进?本科占比最多占47.4%,其次是高中占21.1%。学历要求高吗?硕士占15.8%。工作经验有什么要求?不限占比最多占68.4%,其次是3-5年占21.1%。工作地区在哪?上海占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 803.5714万(元)
Legal Representative: 张莉娟
Date Established:
Credit Code: 91310000MA1H3HWG1M
Registered Address: 中国(上海)自由贸易试验区临港新片区江山路2699弄12号厂房一层101

Partners & Suppliers

芯谦向武汉新芯供应晶圆传输系统零部件 Source
合作客户 芯片制造/晶圆代工
芯谦向华虹半导体供应晶圆传输系统及配套零部件 Source
合作客户 芯片制造/晶圆代工
芯谦作为会员企业参与SEMI中国组织的行业活动及标准制定 Source
供应商 生态合作
芯谦为上海先进半导体提供晶圆盒及传输设备 Source
合作客户 芯片制造/晶圆代工
芯谦为华力微电子提供晶圆传输系统及晶圆盒 Source
合作客户 芯片制造/晶圆代工

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