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About the Company

深圳市梦启半导体装备有限公司成立于2021年,是经深交所主板上市公司长盈精密投资控股的子公司,是一家专注于半导体产业与新能源产业的智能装备制造企业,公司主要专业从事超精密全自动晶圆减薄机、超精密抛光机、超精密全自动晶圆倒角机等硬脆材料的加工装备、以及高精度气浮主轴部件系列产品的研发、生产和销售。产品主要应用于化合物半导体行业,硅基领域。如:硅片、蓝宝石、碳化硅、砷化镓、氮化镓、钽酸锂、铌酸锂等硬脆材料。

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Operating Status: 开业
Registered Capital: 5,000万(元)
Legal Representative: 徐达海
Date Established:
Credit Code: 91440300MA5GLNRF27
Registered Address: 深圳市光明区公明街道上村社区元山工业区B区第34栋201

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