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Company Overview

Development Stage

About the Company

湖南越摩先进半导体有限公司(简称:越摩先进)成立于2020年10月,注册实缴资金4.1亿元,实际投入资金已超过8亿元。公司总部位于湖南株洲,在北京、上海、深圳、长沙等地设有分公司。越摩先进拥有先进封装技术,提供封装设计、多物理场仿真、一站式SiP先进封装量产等服务。
越摩先进产品领域包括算力产品、北斗导航、汽车电子、工业控制、电源管理、存储、生物医疗、可穿戴、物联网等,与超过200家客户建立良好的合作关系。
越摩先进交付能力强、质量可靠,有着超51000平方米的生产车间,已完成封装产品线建设包括Chiplet、SiP、CSP、LGA/BGA、QFN/DFN等。以坚持不懈的创新精神、优秀的团队协作和高质量的产品服务,为客户创造更高的价值,不断推动封装行业的发展和进步。

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How Fast Is Hiring Growing? (17 open positions)

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Note: How fast is hiring at 湖南越摩先进半导体有限公司 growing? 2025: 64 openings (up 68%), 2024: 38 openings (up 52%), 2023: 25 openings (up 19%), 2022: 21 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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-67%
Growth Rate
2026 vs 2025
Master's Hiring by Year: 2026 — 2 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 湖南越摩先进半导体有限公司 growing? Master's recruitment over the years: 2026: 1 openings (down 59%), 2025: 3 openings (up 68%).

— What Are the Salaries Like? (49 records)

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salary range: 4.5K - 50K, 48.9% of roles pay ¥8-15K
Note: salary statistics are based on 49 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 湖南越摩先进半导体有限公司?48.9% of positions earn 8-15K, Undergraduate salary: ¥。Zhuzhou salary ranking top 20,工厂生产类 average salary ¥10.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 湖南越摩先进半导体有限公司? We provide: 工艺工程,md,设备工,质量,wb技术员,人事,会计,工业工程,总账,行政,ie,pi,qe,仿真工程师,内勤,切割,助理工程,材料工程师,设计工程师,设计总. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

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Job Category

  • 工厂生产类
    44.9% of total 44.9%
  • 技工类
    24.5% of total 24.5%
  • 机械/仪器仪表类
    16.3% of total 16.3%
  • 电子/电器/通信技术类
    16.3% of total 16.3%

Education

  • 大专
    67.3% of total 67.3%
  • 本科
    30.6% of total 30.6%
  • 硕士
    2% of total 2%

Experience

  • 3-5年
    34.7% of total 34.7%
  • 不限
    28.6% of total 28.6%
  • 5-10年
    20.4% of total 20.4%
  • 1-3年
    16.3% of total 16.3%
View Detailed Analysis

What does 湖南越摩先进半导体有限公司 require? Who is 湖南越摩先进半导体有限公司 hiring? recruitment: 工厂生产类占比最多占44.9%,其次是技工类占24.5%. What education can get in at ? 大专占比最多占67.3%,其次是本科占30.6%. High education required at ? 硕士占2%. Work experience required at ? 3-5年占比最多占34.7%,其次是不限占28.6%. Where are the job locations at ? 株洲占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 47,900万(元)
Legal Representative: 何新文
Date Established:
Credit Code: 91430200MA4RR48LXU
Registered Address: 湖南省株洲市石峰区云霞大道686号

Partners & Suppliers

湖南越摩与湖南大学开展产学研合作,共同研发先进封装技术 Source
供应商 高校/研究院
湖南越摩使用华大九天的EDA工具进行封装设计 Source
供应商 EDA/IP设计
湖南越摩采购新阳半导体的化学材料 Source
供应商 半导体材料
湖南越摩采购江丰电子的溅射靶材 Source
供应商 半导体材料
湖南越摩采购迈为股份的封装相关设备 Source
供应商 半导体设备

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